The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.

The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.