A display device includes a base layer, a color filter layer on the base layer and including a color filter located at an emission area, a light emitting element layer on the color filter layer and including a light emitting element located at the emission area, a first electrode on a first end of the light emitting element, and a second electrode on a second end of the light emitting element, a circuit layer on the light emitting element layer and including circuit elements and lines connected to the first electrode and the second electrode, and pads on the circuit layer and connected to the lines, and the first electrode and the second electrode may include a reflective conductive material.

A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.

A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.

A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

This disclosure provides a package substrate fabrication method including: forming a first conductive wire and a first connecting unit on a first carrier substrate; forming a first dielectric layer on the first carrier substrate while enabling an end face of the first connecting unit to be exposed; bonding a second carrier substrate to the first dielectric layer and removing the first carrier substrate; disposing a first circuit chip and a second connecting unit on the first conductive wire; forming a second dielectric layer on the second carrier substrate while enabling the first circuit chip and the second connecting unit to be surrounded by the second dielectric layer and an end face of the second connecting unit to be exposed; forming a second conductive wire on the second dielectric layer; disposing a second circuit chip on the second conductive wire; and forming a third dielectric layer on the second carrier substrate.

A display apparatus includes a display panel configured to display an image and including a first pad part, the first pad part including a plurality of first pads disposed at a first edge thereof, and a printed circuit board having an insertion hole in which at least a portion of the first edge of the first pad part is accommodated. The printed circuit board includes a plurality of first terminals disposed on an inner surface of the insertion hole to contact the plurality of first pads.

A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.