A semiconductor package includes a semiconductor chip mounted on a substrate that has a top surface and a bottom surface opposite to each other, and connection members that connect the substrate and the semiconductor chip to each other. The connection members include first connection members disposed on a central region of the semiconductor chip and that have heights equal to each other, and second connection members disposed on an edge region of the semiconductor chip and that have heights equal to each other. The heights of the first connection members differ from the heights of the second connection members.