Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.

A semiconductor module includes a laminated substrate having an insulating plate, a circuit pattern on an upper surface of the insulating plate and a heat dissipating plate on a lower surface of the insulating plate. The module further includes a semiconductor device having upper and lower surfaces, and including a collector electrode on the device upper surface, an emitter electrode and a gate electrode on the device lower surface, and the emitter electrode and the gate electrode each being bonded to an upper surface of the circuit pattern via a bump, and a block electrode bonded to the collector electrode. The block electrode includes a flat plate portion covering over the semiconductor device, and a pair of projecting portions projecting toward the circuit pattern from both ends of the flat plate portion in a thickness direction orthogonal to a surface of the insulating plate, and being bonded to the circuit pattern.

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball; and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

A display device comprises a display panel including a display area including pixels, and a pad area adjacent to the display area, and a driving integrated circuit mounted on the pad area, wherein the pad area includes a stud pad area located at an edge of the pad area and including at least one stud pad electrode, the driving integrated circuit includes a circuit base, and at least one stud bump area overlapping the stud pad area in a thickness direction of the display device and including at least one stud bump, and the at least one stud pad electrode overlaps an edge portion of the at least one stud bump.

An apparatus includes an Integrated Circuit (IC). A first pillar includes a first end and a second end. The first end is connected to the IC and the second end includes a first attachment point collinear with a first central axis of the first pillar. The first attachment point includes a first solder volume capacity. A second pillar includes a third end and a fourth end. The third end is connected to the IC and the fourth end includes a second attachment point disposed on a side of the second pillar facing the first pillar. The second attachment point includes a second solder volume capacity being less than the first solder volume capacity. A first distance between the first end and the second end is less than a second distance between the third end and the fourth end.

An apparatus includes an Integrated Circuit (IC). A first pillar includes a first end and a second end. The first end is connected to the IC and the second end includes a first attachment point collinear with a first central axis of the first pillar. The first attachment point includes a first solder volume capacity. A second pillar includes a third end and a fourth end. The third end is connected to the IC and the fourth end includes a second attachment point disposed on a side of the second pillar facing the first pillar. The second attachment point includes a second solder volume capacity being less than the first solder volume capacity. A first distance between the first end and the second end is less than a second distance between the third end and the fourth end.

A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.

A semiconductor device includes a first electronic component, a second electronic component, a third electronic component, a plurality of first interconnection structures, and a plurality of second interconnection structures. The second electronic component is between the first electronic component and the third electronic component. The first interconnection structures are between and electrically connected to the first electronic component and the second electronic component. Each of the first interconnection structures has a length along a first direction substantially parallel to a surface of the first electronic component and a width along a second direction substantially parallel to the surface and substantially perpendicular to the first direction. The length is larger than the width. The second interconnection structures are between and electrically connected to the second electronic component and the third electronic component.

The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball, and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.