A semiconductor package includes a die, a redistribution structure and a plurality of conductive terminals. The redistribution structure is disposed below and electrically connected to the die. The redistribution structure includes a plurality of conductive patterns, and at least one of the plurality of conductive patterns has a cross-section substantially parallel to the surface of the die. The cross-section has a long-axis and a short-axis, and the long-axis intersects with a center axis of the die. The conductive terminals are disposed below and electrically connected to the redistribution structure.

A semiconductor package includes a die, a first conductive pattern, a second conductive pattern and first and second under-ball metallurgy (UBM) patterns. The first conductive pattern and the second conductive pattern are disposed below and electrically connected to the die, wherein the first conductive pattern has an ellipse-like shape, and the second conductive pattern has a circular shape. The first and second under-ball metallurgy (UBM) patterns correspond to the first and second conductive patterns, the first conductive pattern has a first length, the second conductive pattern has a second length, the first and second UBM patterns have a third length, wherein the first length is larger than the third length and the second length is smaller than the third length.

An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles in comparison to known anisotropic conductive films. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder, and repeating units of polygons formed by successively connecting the centers of a plurality of conductive particles are disposed repeatedly in the vertical and horizontal directions in a plan view. The sides of the polygons of the repeating units intersect diagonally with the long-side direction or the short-side direction of the anisotropic conductive film.

An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles in comparison to known anisotropic conductive films. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder, and repeating units of polygons formed by successively connecting the centers of a plurality of conductive particles are disposed repeatedly in the vertical and horizontal directions in a plan view. The sides of the polygons of the repeating units intersect diagonally with the long-side direction or the short-side direction of the anisotropic conductive film.