Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.

The disclosed subject matter relates to liquid metal interconnects for power semiconductor modules. For example, disclosed herein are semiconductor package devices, comprising: a semiconductor device comprising an electrode and/or contact pad; a solid metal circuit element; and a liquid metal interface comprising a liquid metal material. The liquid metal interface can append at least a portion of the solid metal circuit element to at least a portion of the electrode and/or contact pad within a contact area. Adhesive forces, cohesive forces, surface tension forces, capillary forces, viscosity, and/or wetting characteristics enable containment of the liquid metal interface within the contact area. Also disclosed herein are methods of making and use of any of the devices disclosed herein.