Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/42
Wire connectors; Manufacturing methods related thereto
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H01L2224/4351

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
20250201673 · 2025-06-19 ·

A semiconductor device includes: a semiconductor chip having a source electrode pad and mounted on a die pad via a die bonding material; a wire electrically connected with the source electrode pad of the semiconductor chip; and a sealing body sealing the semiconductor chip and the wire. The wire and the source electrode pad are made of different types of metals to each other. A wire bonding layer made of sintered metal is interposed between the source electrode pad and the wire. The wire is electrically connected with the source electrode pad via the wire bonding layer.