An electrode connection structure includes: a first electrode of an electrical circuit; and a second electrode of the electrical circuit that is electrically connected to the first electrode. The first and second electrodes are oppositely disposed in direct or indirect contact with each other. A plated lamination is substantially uniformly formed by plating process from a surface of a contact region and opposed surfaces of the first and second electrodes. A void near the surface of the contact region is filled by formation of the plated lamination. Portions of the plated lamination formed from the opposed surfaces of the first and second electrodes in a region other than the contact region are not joined together.

An integrated circuit package includes a substrate having a first surface and a second surface. An electronic integrated circuit chip has a first surface and a second surface, with the second surface mounted on the first surface of the substrate. A preformed glass cover is assembled on the first surface of the substrate and arranged to contain the electronic integrated circuit chip.