Disclosed is a device including a first finger of a plurality of lead fingers of a lead frame connected to a first flag. A second finger of the plurality of lead fingers of the lead frame is connected to a second flag. A semiconductor die is coupled to the lead frame. An encapsulant covers the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, and excludes the first flag and the second flag. The first flag and the second flag are separated and electrically isolated from one another by the encapsulant.

A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.

A semiconductor device includes a semiconductor substrate having a main surface; a first coil formed on the main surface; a first insulating film formed over the first coil and having a first main surface; a second insulating film formed on the first main surface of the first insulating film and having a second main surface; and a second coil formed on the second main surface of the second insulating film, wherein the first main surface of the first insulating film has a first area on which the second insulating film is formed, and has a second area without the first area in a plan view, and wherein the second insulating film is surrounded with the second area in the plane view.

A semiconductor device includes: a substrate; a device region provided in the substrate; a terminal covering the device region in a plan view; a plurality of pseudo-bumps densely arranged on the terminal in a state of being opened from a wire; and at least one genuine bump arranged more sparsely than the plurality of the pseudo-bumps on the terminal in a state of being connected to the wire.

There is provided a semiconductor device including: a semiconductor element; a support substrate configured to support the semiconductor element; an intermediate metal layer interposed between the semiconductor element and the support substrate in a thickness direction of the support substrate, wherein the semiconductor element and the intermediate metal layer are bonded by solid phase diffusion bonding; and a first positioning portion including a portion of the semiconductor element and a first portion of the intermediate metal layer and configured to suppress relative movement between the semiconductor element and the intermediate metal layer.

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.

Disclosed is a device including a lead frame having a body with a top surface and a bottom surface and lead fingers. Each lead finger has a first end and a second end. A semiconductor die is coupled to the body. A first flag is a first exposed portion of the body and integral with the first end of a first lead finger. The first flag and the first lead finger are a continuous material. A second flag is a second exposed portion of the body and integral with the first end of a second lead finger. The second flag and the second lead finger are a continuous material. An encapsulant covers the die, the bottom surface of the body, the first end of the lead fingers and a portion of the top surface of the body. The flags are separated and electrically isolated from one another by the encapsulant.

Disclosed is a device including a first finger of a plurality of lead fingers of a lead frame connected to a first flag. A second finger of the plurality of lead fingers of the lead frame is connected to a second flag. A semiconductor die is coupled to the lead frame. An encapsulant covers the semiconductor die, the lead frame, and a first end of the plurality of lead fingers, and excludes the first flag and the second flag. The first flag and the second flag are separated and electrically isolated from one another by the encapsulant.

Disclosed is a device including a lead frame having a body with a top surface and a bottom surface and lead fingers. Each lead finger has a first end and a second end. A semiconductor die is coupled to the body. A first flag is a first exposed portion of the body and integral with the first end of a first lead finger. The first flag and the first lead finger are a continuous material. A second flag is a second exposed portion of the body and integral with the first end of a second lead finger. The second flag and the second lead finger are a continuous material. An encapsulant covers the die, the bottom surface of the body, the first end of the lead fingers and a portion of the top surface of the body. The flags are separated and electrically isolated from one another by the encapsulant.

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.