H01L2224/78252

DEVICE FOR HEATING AND DETERMINING AN ACTUAL TEMPERATURE OF A BONDING TOOL OF AN ULTRASONIC BONDING DEVICE

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
20230318207 · 2023-10-05 ·

The invention relates to an electrical element having at least one functional region and a contact surface, wherein a connecting element is arranged on the contact surface, wherein the connecting element comprises a stranded wire coated with sintered material, wherein the stranded wire is connected, in particular sintered, to the contact surface by a sintered material. Furthermore, the invention relates to a method for producing the electrical element according to the invention.

SELF-CLEANING WIRE BONDING MACHINE
20210162470 · 2021-06-03 ·

A self-cleaning wire bonding machine includes a spool, a cleaning tank, a drying element, a tensioner, and a nozzle. The spool includes a rotating body and a metal wire wound around the rotating body. The cleaning tank is configured to clean the metal wire after the rotating body passes the metal wire through the cleaning tank. The drying element is configured to dry the metal wire after passing through the cleaning tank. The tensioner is configured to adjust a tension of the metal wire. The nozzle is configured to heat the metal wire, and the metal wire exits out of the nozzle after being heated.

Wedge bonding tools, wedge bonding systems, and related methods

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

Wire bonding apparatus

Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 m and not greater than 600 m. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50 C. and not higher than 100 C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.

Bonding Device
20210005571 · 2021-01-07 ·

Bonding device for producing bonding connections, in particular wire bonding connections, tape bonding connections and ball bonding connections, on carriers fixed outside the bonding device and having contact surfaces for the bonding connections, in different spatial directions with respect to the respective carrier, the bonding device comprising a base body, a bonding tool which is movable relative to the base body for applying a bonding force to a bonding means placed on the contact surface of the carrier to produce a material bond between the bonding means and the contact surface as a bonding connection, and bonding force generating means for generating a bonding force directed towards the contact surface when the bonding tool is placed on the carrier, wherein the bonding force generating means comprise a bonding force setting device for realizing a predetermined effective bonding force independently of its spatial direction of action.

Curtain airbag device mounting structure and curtain airbag deployment method

A curtain airbag device mounting structure includes: a first pillar forming a part of a front pillar and extends substantially along a vehicle height direction; a second pillar forming another part of the front pillar, the second pillar being disposed on a rear side of a vehicle relative to the first pillar at a predetermined distance from the first pillar and extending substantially along the vehicle height direction; a transparent member bridged between the first pillar and the second pillar; and a curtain airbag device including a curtain airbag stored along a roof side rail and the second pillar, the curtain airbag being configured to inflate and deploy in a curtain-like fashion over a side portion of a cabin of the vehicle in case of a collision of the vehicle.

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
20190375043 · 2019-12-12 ·

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

APPARATUS AND METHOD FOR WIRE PREPARATION

A wire bonding tool for bonding a micro-coaxial wire to a bonding surface includes an electrical-energy application mechanism configured to apply electrical-energy to remove a portion of an electrically conductive shield layer of the micro-coaxial wire to expose a portion of an insulating layer of the micro-coaxial wire, a thermal-energy application mechanism configured to apply thermal-energy to the micro-coaxial wire to remove the exposed portion of the insulating layer of the micro-coaxial wire to expose a portion of a core wire of the micro-coaxial wire, and a bonding head configured to bond the exposed portion of the core wire of the micro-coaxial wire to the bonding surface.

Wedge bonding tools, wedge bonding systems, and related methods

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.