A method comprises: providing a layer of curable adhesive material (4) on a substrate (2); forming a pattern of microstructures (321) on the layer of curable adhesive material (4); curing a first region (42) of the layer of curable adhesive material (4) at a first level and a second region (44) of the layer of curable adhesive material (4) at a second level greater than the first level; providing a solid circuit die (6) to directly attach to a major surface of the first region (42) of the layer of curable adhesive material (4); and further curing the first region (42) of the layer of curable adhesive material (4) to anchor the solid circuit die (6) on the first region (42) by forming an adhesive bond therebetween. The pattern of microstructures (321) may include one or more microchannels (321), the method further comprising forming one or more electrically conductive traces in the microchannels (321), in particular, by flow of a conductive particle containing liquid (8) by a capillary force and, optionally, under pressure. The at least one microchannel (321) may extend from the second region (44) to the first region (42) and have a portion beneath the solid circuit die (6). The solid circuit die (6) may have at least one edge disposed within a periphery of the first region (42) with a gap therebetween. The solid circuit die (6) may have at least one contact pad (72) on a bottom surface thereof, wherein the at least one contact pad (72) may be in direct contact with at least one of the electrically conductive traces in the microchannels (321). Forming the pattern of microstructures (321) may comprise contacting a major surface of a stamp (3) to the layer of curable adhesive material (4), the major surface having a pattern of raised features (32) thereon. The curable adhesive material (4) may be cured by an actinic light source such as an ultraviolet (UV) light source (7, 7′), wherein a mask may be provided to at least partially block the first region (42) of the layer of curable adhesive material (4) from the cure. The stamp (3) may be positioned in contact with the curable adhesive material (4) to replicate the pattern of raised features (32) to form the microstructures (321) while the curable adhesive material (4) is selectively cured by the actinic light source such as the ultraviolet (UV) light source (7). The first region (42) of the layer of curab

A method comprises: providing a layer of curable adhesive material (4) on a substrate (2); forming a pattern of microstructures (321) on the layer of curable adhesive material (4); curing a first region (42) of the layer of curable adhesive material (4) at a first level and a second region (44) of the layer of curable adhesive material (4) at a second level greater than the first level; providing a solid circuit die (6) to directly attach to a major surface of the first region (42) of the layer of curable adhesive material (4); and further curing the first region (42) of the layer of curable adhesive material (4) to anchor the solid circuit die (6) on the first region (42) by forming an adhesive bond therebetween. The pattern of microstructures (321) may include one or more microchannels (321), the method further comprising forming one or more electrically conductive traces in the microchannels (321), in particular, by flow of a conductive particle containing liquid (8) by a capillary force and, optionally, under pressure. The at least one microchannel (321) may extend from the second region (44) to the first region (42) and have a portion beneath the solid circuit die (6). The solid circuit die (6) may have at least one edge disposed within a periphery of the first region (42) with a gap therebetween. The solid circuit die (6) may have at least one contact pad (72) on a bottom surface thereof, wherein the at least one contact pad (72) may be in direct contact with at least one of the electrically conductive traces in the microchannels (321). Forming the pattern of microstructures (321) may comprise contacting a major surface of a stamp (3) to the layer of curable adhesive material (4), the major surface having a pattern of raised features (32) thereon. The curable adhesive material (4) may be cured by an actinic light source such as an ultraviolet (UV) light source (7, 7′), wherein a mask may be provided to at least partially block the first region (42) of the layer of curable adhesive material (4) from the cure. The stamp (3) may be positioned in contact with the curable adhesive material (4) to replicate the pattern of raised features (32) to form the microstructures (321) while the curable adhesive material (4) is selectively cured by the actinic light source such as the ultraviolet (UV) light source (7). The first region (42) of the layer of curab

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.

A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.