A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

A method for producing a printed circuit board structure comprising at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layer are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

A printed circuit board structure that includes at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layers are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.

A printed circuit board structure that includes at least one insulation layer, at least one conductor layer, and at least one embedded component having a contact pad that has an outer barrier layer, in which structure at least two conductor paths/conductor layers are connected to at least two connections using vias, and each via runs from a conductor path/conductor layer directly to the barrier contact layer of the corresponding connection of the component.