Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/84805
involving forming a eutectic alloy at the bonding interface
Filter patents View analytics View as hierarchy Open in page

H01L2224/84805

Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
20210351113 · 2021-11-11 ·

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Integrated Circuit Having Die Attach Materials with Channels and Process of Implementing the Same
20210351113 · 2021-11-11 ·

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Integrated circuit having die attach materials with channels and process of implementing the same
11424177 · 2022-08-23 · ·

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Integrated circuit having die attach materials with channels and process of implementing the same
11424177 · 2022-08-23 · ·

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND PROCESS OF IMPLEMENTING THE SAME
20240079320 · 2024-03-07 ·

A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.