H01L23/04
characterised by the shape; of the container or parts, e.g. caps, walls
H01L23/04
characterised by the shape; of the container or parts, e.g. caps, walls
H01L23/043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H01L23/051
another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
H01L23/051
another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type