H01L23/34
Arrangements for cooling, heating, ventilating or temperature compensation; ; Temperature sensing arrangements
H01L23/34
Arrangements for cooling, heating, ventilating or temperature compensation; ; Temperature sensing arrangements
H01L23/36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L23/36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L23/373
Cooling facilitated by selection of materials for the device; or materials for thermal expansion adaptation, e.g. carbon
H01L23/373
Cooling facilitated by selection of materials for the device; or materials for thermal expansion adaptation, e.g. carbon
H01L23/3735
Laminates or multilayers, e.g. direct bond copper ceramic substrates
H01L23/3735
Laminates or multilayers, e.g. direct bond copper ceramic substrates