The end-face incident type semiconductor light receiving device has a first light absorbing region on the main surface side of the semiconductor substrate and causes light incident from the end-face of the semiconductor substrate to enter the first light absorbing region by reflection or refraction, and the first reflective section is provided on the main surface side of the semiconductor substrate to cause light transmitted through the light absorbing region to enter the first light absorbing region, and a single second reflective section is provided on the back surface for causing the light reflected by the first reflective section and transmitted through the first light absorbing region to reflect directly toward the first light absorbing region.

A semiconductor structure includes a group IV substrate and a patterned group III-V device over the group IV substrate. Precursor stacks having at least one precursor metal are situated over at least one portion of the patterned group III-V device. A blanket dielectric layer is situated over the patterned group III-V device. Contact holes in the blanket dielectric layer are situated over each precursor stack. A filler metal is situated in each contact hole and over each precursor stack. The patterned group III-V device can be optically and/or electrically connected to group IV devices in the group IV substrate. Additional contact holes in the blanket dielectric layer can be situated over the group IV devices and filled with the filler metals.

An array substrate includes a substrate, a protection layer, and a photodiode. The protection layer is disposed over the substrate, has a single layer-structure, and is provided with a through-hole therein. The photodiode includes a lower electrode, a PN junction and an upper electrode, which are sequentially over the substrate. The PN junction is within the through-hole. The protection layer and the PN junction of the photodiode have a substantially same thickness. The array substrate further includes a thin-film transistor over the substrate. An orthographic projection of an active layer of the thin-film transistor on the substrate does not overlap with an orthographic projection of the PN junction of the photodiode on the substrate.

There may be provided a radiation sensor, that may include multiple semiconductor regions that form a sensing PN junction and a draining PN junction that is located below the sensing PN junction; a bias circuit that is configured to (i) bias the sensing PN junction to maintain a sensing PN junction depletion region of a fixed size during a first sensing period and during a second sensing period, and (i) bias the draining PN junction to form a draining PN junction depletion region of a first size during the first sensing period and of a second size during the second sensing period; and an output circuit that is configured to generate a first output signal that represent sensed radiation out of radiation that impinged on the radiation sensor during the first sensing period, and to generate a second output signal that represent sensed radiation out of radiation impinged on the radiation sensor during the second sensing period.

A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical waveguide is coupled to the optical transmitter and the optical receiver and overlaps the scribe line. During a substrate dicing operation, a portion of the test optical waveguide overlapping the scribe line is removed.

A photonic integrated circuit device includes a semiconductor substrate (e.g., wafer) having a chip region therein, which is bounded on at least one side thereof by a scribe line. The chip region includes an optical transmitter, an optical receiver and a test optical waveguide. This test optical waveguide is coupled to the optical transmitter and the optical receiver and overlaps the scribe line. During a substrate dicing operation, a portion of the test optical waveguide overlapping the scribe line is removed.

Example embodiments relate to controlling detection time in photodetectors. An example embodiment includes a device. The device includes a substrate. The device also includes a photodetector coupled to the substrate. The photodetector is arranged to detect light emitted from a light source that irradiates a top surface of the device. A depth of the substrate is at most 100 times a diffusion length of a minority carrier within the substrate so as to mitigate dark current arising from minority carriers photoexcited in the substrate based on the light emitted from the light source.

An electromagnetic wave detector includes: a substrate; an insulating layer provided on the substrate; a graphene layer provided on the insulating layer; a pair of electrodes provided on the insulating layer, with the graphene layer being interposed therebetween; and buffer layers interposed between the graphene layer and the electrodes to separate the graphene layer and the electrodes from each other. The electromagnetic wave detector array includes arrayed electromagnetic wave detectors that are the same as or different from each other.

A semiconductor device includes a semiconductor structure formed on a substrate, a gate formed on a first side of the semiconductor structure, and a charge collector layer formed on a second side of the semiconductor structure.

The invention relates to quantum dot and photodetector technology, and more particularly, to quantum dot infrared photodetectors (QDIPs) and focal plane array. The invention further relates to devices and methods for the enhancement of the photocurrent of quantum dot infrared photodetectors in focal plane arrays.