Embodiments described herein may be related to apparatuses, processes, and techniques related to a transceiver architecture for inter-die communication on-package using mm-wave/THz interconnects. In particular, amplifier-less transceivers are used in combination with on-package low loss transmission lines to provide inter-die communication. In embodiments, signals on the interconnect may be transmitted between up conversion mixers and down conversion mixers without any additional amplification. Other embodiments may be described and/or claimed.

A transmitter component includes an input terminal and a first semiconductor portion with doped regions of a control-side interface circuit. The control-side interface circuit converts a digital input signal received at the input terminal into a transmit radio frequency signal. A control-side metallization structure on at least one of two horizontal main surfaces of the first semiconductor portion includes at least a portion of a control-side antenna structure that emits the transmit radio frequency signal as radio wave. A transceiver circuit may include the transmitter component and a receiver component.

A transmitter component includes an input terminal and a first semiconductor portion with doped regions of a control-side interface circuit. The control-side interface circuit converts a digital input signal received at the input terminal into a transmit radio frequency signal. A control-side metallization structure on at least one of two horizontal main surfaces of the first semiconductor portion includes at least a portion of a control-side antenna structure that emits the transmit radio frequency signal as radio wave. A transceiver circuit may include the transmitter component and a receiver component.

Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

Embodiments described herein may be related to apparatuses, processes, and techniques related to a transceiver architecture for inter-die communication on-package using mm-wave/THz interconnects. In particular, amplifier-less transceivers are used in combination with on-package low loss transmission lines to provide inter-die communication. In embodiments, signals on the interconnect may be transmitted between up conversion mixers and down conversion mixers without any additional amplification. Other embodiments may be described and/or claimed.