Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
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H01L2924/16171

Method of fabricating semiconductor device
10510668 · 2019-12-17 · ·

A method of fabricating a semiconductor device is provided. A hybrid bonded structure is provided. A cover lid comprising a base portion and at least one dummy portion protruding from the base portion is provided. The at least one dummy portion of the cover lid is bonded to the hybrid bonding structure. The base portion is removed. A redistribution structure over the hybrid bonding structure and the at least one dummy portion is formed.