A package assembly includes a package substrate, a package lid located on the package substrate and including a plate portion, an outer foot extending from the plate portion, and an inner foot having a height greater than or equal to a height of the outer foot, extending from the plate portion and including a first inner foot corner portion located inside a first corner of the outer foot, and an adhesive that adheres the outer foot to the package substrate and adheres the inner foot to the package substrate.

Provided is a semiconductor package having a package housing in an engraved surface form and a method of manufacturing the same, wherein the semiconductor package includes: at least one substrate on which at least one semiconductor chip is installed; at least one terminal lead electrically connected to the substrates; electrical connectors for connecting the semiconductor chips to the substrates or the terminal leads; a package housing covering the semiconductor chips, the electrical connectors, and the at least one substrate; at least one stopper which is formed of a material same as that of the package housing, is higher by a certain height than exposed surfaces of the substrates, is disposed on the exposed surfaces of the substrates, or covers at least a part of the exposed surfaces; and at least one heat sink transmitting heat from the semiconductor chips and radiating heat, wherein the at least a part of the exposed surfaces of the at least one substrate is formed on the upper surface, the lower surface, or the upper and lower surfaces of the package housing and the exposed surfaces of the at least one substrate are joined to the heat sinks by using heat transfer connectors interposed therebetween. Accordingly, the full thickness of the heat transfer connectors may be uniformly maintained.

A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle θ is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<θ<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers. Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.

A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°<θ<90°. The adhesive layer surrounds the semiconductor device on the substrate and at least continuously disposed at two of the sides of the substrate, wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

A ceramic encapsulating casing and a mounting structure thereof are provided. The ceramic encapsulating casing includes a ceramic substrate, a ceramic insulator, a cover plate and a pad structure. The ceramic substrate is provided with a cavity with an upward opening. The ceramic insulator is disposed on the ceramic substrate and provided with a radio frequency transmission structure. The pad structure is arranged on a bottom surface of the ceramic substrate. and includes a plurality of second pads that are arranged for transmitting signals and arranged in an array manner. A plurality of solder balls are attached to the plurality of second pads in one-to-one correspondence.

A high-frequency package includes a radio wave shielding portion that shields radio waves radiated from a high-frequency component, a radio wave absorber that is arranged facing the high-frequency component and that absorbs the radio waves, and an adjusting means that enables adjustment of distance from the radio wave absorber to the high-frequency component by adjusting a position of the radio wave absorber with respect to the radio wave shielding portion.

A semiconductor package includes a module substrate having opposite top and bottom surfaces, a semiconductor chip provided with bumps and mounted on the top surface of the module substrate via the bumps, and a metal member having a top portion disposed at a level higher than the semiconductor chip with reference to the top surface of the module substrate and including the semiconductor chip in plan view and a side portion extending from the top portion toward the module substrate. The module substrate includes a first metal film disposed on or in at least one of the bottom surface and an internal layer of the module substrate. The first metal film is electrically connected to the bumps and reaches a side surface of the module substrate. The side portion is thermally coupled to the first metal film at the side surface of the module substrate.

A filter circuit component includes desired frequency characteristics without being influenced by a parasitic inductance and a parasitic capacitance, and since the ground terminal of the filter circuit component connected to the mounting electrode of the high-frequency component is connected to the ground electrode of the high-frequency component through the via conductors of the high-frequency component at the shortest distance, the packing density of the filter circuit component is significantly increased and the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components mounted on the high-frequency component is increased.