An optical distance measurement apparatus that measures a distance using a round-trip time of light to an object includes an irradiator, a plurality of SPADs, a plurality of signal output units, a response number detector, a timing identifier, and a timing corrector. The response number detector detects a response number representing the number of responding one of the SPADs based on a pulse signal. The timing identifier identifies a temporary timing based on a state of variation in the response number along a time series and identifies a detection timing representing a timing when the optical distance measurement apparatus detects light in accordance with the temporary timing. The timing corrector acquires a correction time representing a time difference between the temporary timing and a true timing corresponding to a distance to an object and sets a timing corrected from the temporary timing by the correction time as the detection timing.

Provided are a single-photon avalanche diode (SPAD) pixel structure and a method of manufacturing the same. More particularly, provided are a SPAD pixel structure and a method of manufacturing the same, including an additional PN junction in a vertical or horizontal direction to increase photon detection efficiency and thus improve the sensitivity in an imaging device.

A photoelectric conversion element provided in a semiconductor layer having first and second surfaces includes a first region of a first conductivity type, a second region of a second conductivity type closer to the second surface than the first region and forming a p-n junction with the first region, a third region of the first conductivity type closer to the second surface than the second region, a fourth region of the second conductivity type closer to the second surface than the third region, a fifth region of the second conductivity type between the third fourth regions, and a sixth region of the second conductivity type surrounding a region where the first, second, third, and fifth regions are disposed in a plan view. The fifth region has an area smaller than that of the third region in the plan view, and overlaps with the first region in the plan view.

A light pixel projection module includes a pixel light source, a light pixel projection assembly for projecting a light pixel generated by the light pixel generating assembly, and an optical time-of-flight (ToF) measurement assembly for measuring a distance between the projection module and an external object. The ToF measurement assembly includes a ToF light source, a beam splitting optical device for splitting an incident light beam into a reflected main beam component and a transmitted and attenuated secondary beam component, and an APD-based ToF photodetector for light detection. The beam splitting optical device is arranged in the optical path of light beams emitted by the ToF light source such that it splits each light beam emitted by the ToF light source into a main beam component leaving the module and heading towards the external object and a secondary beam component remaining within the module and hitting the ToF photodetector.

An embodiment method of operating an imaging device including a sensor array including a plurality of pixels, includes: capturing a first low-spatial resolution frame using a subset of the plurality of pixels of the sensor array; generating, using a processor coupled to the sensor array, a first depth map using raw pixel values of the first low-spatial resolution frame; capturing a second low-spatial resolution frame using the subset of the plurality of pixels of the sensor array; generating, using the processor, a second depth map using raw pixel values of the second low-spatial resolution frame; and determining whether an object has moved in a field of view of the imaging device based on a comparison of the first depth map to the second depth map.

An avalanche photodiode includes a silicon layer on a substrate; a germanium layer on the silicon layer; a cathode and an anode on any of the silicon layer and the germanium layer; and a plurality of contacts on the germanium layer, in addition to the cathode and the anode. The silicon layer can include a highly doped region at each end, an intrinsic doped region in a middle, and an intermediately doped region between the highly doped region at each end and the intrinsic doped region, and the cathode and the anode are each at a respective a highly doped region at each end. The germanium layer can include a plurality of highly doped regions with each including one of the plurality of contacts.

A photon detection device having a high light detection efficiency. The photon detection device includes a first light reception part which receives a gate signal and outputs a first signal; a second light reception part which receives a gate signal and outputs a second signal; and a determination part which determines whether or not a photon is received, on the basis of the first signal from the first light reception part and the second signal from the second light reception part. The photon is incident on the first light reception part among the first light reception part and the second light reception part, and the breakdown voltage of the second light reception part is higher than the breakdown voltage of the first light reception part.

An electric circuit includes a plurality of superconducting components, each of the plurality of superconducting components having: a respective first terminal; a respective second terminal; and a respective input. The electric circuit further includes a bias current source electrically-connected to the respective first terminal of each of the plurality of superconducting components. The bias current source is configured to provide a bias current adapted to cause the electric circuit to function as a logical OR gate on the respective inputs of the plurality of superconducting components. The electric circuit further includes an output node adapted to output a state of the logical OR gate.

To reduce power consumption in a solid-state image sensor that detects weak light. The solid-state image sensor includes a photodiode, a resistor, a measuring unit, and a control unit. The photodiode photoelectrically converts incident light and outputs a photocurrent. The resistor drops a potential of one end of the photodiode to a value lower than a power supply potential every time a photocurrent is output. The measuring unit measures illuminance of the incident light on the basis of a frequency of dropping of the potential of one end. The control unit controls the power supply potential to a lower value as the measured illuminance is higher.

An integrated circuit is formed in a semiconductor substrate. An array of single-photon-avalanche diodes is formed at a front side of the semiconductor substrate. The array includes first and second diodes that are adjacent to each other. A Bragg mirror is positioned between the first and second diodes. The Bragg mirror is configured to prevent a propagation of light between the first and second diodes.