Contacts for solar cells and other optoelectronic devices are provided. Embodiments described herein take advantage of the surface Fermi level pinning effect to build an electrical field inside of a semiconductor to extract or inject carriers for solar cells, photodetectors, and light-emitting device applications. For example, n-type or p-type two-dimensional (2D) materials can be used in contact with an n-type semiconductor to form a “p-region” so that a p-n junction, or an i-n or n-n+ junction can be constructed. Similarly, n-type or p-type 2D materials can be used in contact with a p-type semiconductor to form an “n-region” so that an n-p junction, or an i-p or p-p+ junction can be constructed. These structures can provide sufficiently high electrical field inside the semiconductor to extract photogenerated carriers in solar cells and photodetectors or inject minority carriers for light-emitting devices.

A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

The present invention relates to a photovoltaic module backsheet, comprising photovoltaic module backsheet comprising, in order: a functional layer; a connecting layer; and a weather-resistant layer, wherein each layer of the backsheet comprises at least 50 wt. % polyolefin and the backsheet is free of fluorinated polymers, characterized in that: i) the functional layer comprises a blend of polyethylene and a polyethylene copolymer; and ii) the weather-resistant layer comprises polypropylene; a UV stabilizer; a primary antioxidant, which primary antioxidant is a phenolic antioxidant or an aromatic amine antioxidant; and secondary antioxidant, which secondary antioxidant is a trivalent phosphorus containing antioxidant or a thioether containing antioxidant. The present invention also relates to a process for producing the backsheet and a photovoltaic module comprising the backsheet according to the present invention.

Method of manufacturing a photovoltaic module comprising at least a first layer and a second layer affixed to each other by means of an encapsulant, said method comprising a lamination step wherein the encapsulant material comprises a silane-modified polyolefin having a melting point below 90° C., pigment particles and an additive comprising a cross-linking catalyst; and wherein in said lamination step heat and pressure are applied to the module, said heat being applied at a temperature between 60° C. and 125° C.

Discussed is a tandem solar cell manufacturing method including etching a crystalline silicon substrate, whereby a solar cell can be obtained which does not have a pyramid-shaped defect on a surface of the substrate, inhibits the generation of a shunt through the substrate having excellent surface roughness properties, and can secure fill factor properties, the solar cell being capable of being obtained through the tandem solar cell manufacturing method. The method includes preparing a crystalline silicon substrate; performing an isotropic etching process of the substrate; and removing a saw damage on a surface of the substrate by performing an anisotropic etching process of the isotropically etched substrate.

In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.

The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

The invention discloses a conductive paste for forming the electrode on the surface of solar cell, which contains conductive powder, mixed glass and organic phase; wherein, the mixed glass comprises the following two types of glass components: the first type of glass is at least one selected from the tellurium glass which does not contain lead substantially and having tellurium, bismuth, lithium as the essential component; The second type of glass is at least one kind of lead silicate glass, which having lead and silicon as essential components and does not contain tellurium substantially. The invention also provides a solar cell prepared by printing the conductive paste as a surface electrode and a manufacturing method of the solar cell. The solar cell made of the conductive paste of this invention has good EL performance in inspection, excellent ohmic contact of the cell, high cell conversion efficiency, better reliability, and strong bonding strength, the adhesion performance is taken into account while improving reliability and ohmic contact.

A method for producing a photovoltaic solar cell, including the method steps: A. providing at least one solar cell precursor having at least one base and at least one emitter; B. providing a metal film on a back side of the solar cell precursor, so that the metal film is electrically conductively connected to the base or the emitter, the metal film being formed as an integral component of the back side contact and the solar cell being terminated on the back side. The at least one cell connection region on at least one side of the metal film overhangs the edge of the solar cell precursor by at least 1 mm, preferably by at least 3 mm.

Embodiments of a degradation phenomenon treatment method based on a photovoltaic module and a related device are disclosed. A high frequency signal is applied to the photovoltaic module when a degradation phenomenon occurs in the photovoltaic module to protect the photovoltaic module and suppress or eliminate the degradation phenomenon. The degradation phenomenon refers to degradation of electricity generation efficiency of the photovoltaic module under effect of an electric potential. Embodiments of the degradation phenomenon treatment method and the device resolve issues associated with a declined electrical energy conversion capability and decreased electricity generation efficiency of a photovoltaic module caused by a surface polarization phenomenon, a potential induced degradation (PID) phenomenon occurring in the photovoltaic module, or both.