Example implementations include a method of mass transfer of display elements, by depositing one or more resist layers between one or more display elements disposed on a photoemitting layer, depositing at least one stress buffer layer between the resist layers, removing the resist layer and at least a portion of the photoemitting layer disposed in contact with the resist layers to form resist layer gaps on a wafer substrate, dicing the wafer substrate at the resist layer gaps to form at least one wafer die, separating the wafer substrate from the display elements by irradiation at corresponding first surfaces of the display elements, removing the stress buffer layers from the wafer die, and bonding the portion of the display elements to a first handler substrate at one or more electrode pads of the portion of the display elements.

A method for producing a multiplicity of semiconductor chips (13) is provided, comprising the following steps: providing a wafer (1) comprising a multiplicity of semiconductor bodies (2), wherein separating lines (9) are arranged between the semiconductor bodies (2), depositing a contact layer (10) on the wafer (1), wherein the material of the contact layer (10) is chosen from the following group: platinum, rhodium, palladium, gold, and the contact layer (10) has a thickness of between 8 nanometres and 250 nanometres, inclusive, applying; the wafer (1) to a film (11), at least partially severing the wafer (1) in the vertical direction along the separating lines (9) or introducing fracture nuclei (12) into the wafer (1) along the separating lines (9), and breaking the wafer (1) along the separating lines (9) or expanding the film (11) such that a spatial separation of the semiconductor chips (13) takes place, wherein the contact layer (10) is also separated. A semiconductor chip, a component and a method for producing the latter are also provided.

A quantum dot ink, a method of manufacturing a display panel, and the display panel are provided. The quantum dot ink includes an organic solvent and quantum dots dispersed in the organic solvent. The quantum dots include luminescent quantum dots and blocking quantum dots. Dispersion effect of the quantum dot ink during inkjet printing is inhibited by adding the blocking quantum dots into the quantum do ink. This can prevent a coffee ring effect, and enhance smoothness and uniformity of a quantum dot film surface, thereby allowing the display panel to exhibit excellent display quality.

A micro light emitting device includes a first semiconductor layer doped with a first conductivity type, a light emitting layer arranged on an upper surface of the first semiconductor layer, a second semiconductor layer arranged on an upper surface of the light emitting layer and doped with a second conductivity type electrically opposite to the first conductivity type, an insulating layer arranged on an upper surface of the second semiconductor layer, a first electrode arranged on an upper surface of the insulating layer and electrically connected to the first semiconductor layer, a second electrode arranged on the upper surface of the insulating layer and electrically connected to the second semiconductor layer, and an aluminum nitride layer arranged on a lower surface of the first semiconductor layer and having a flat surface.

In an embodiment a method for manufacturing at least one electronic component includes providing a second surface area of the component adjacent to a first surface area, wherein the second surface area is repulsive to a first fluid to be applied, applying the first fluid without additional pressurization to the first and/or second surface area, wherein the first surface area is wetted by the first fluid and the first fluid is repelled from the second surface area and applying a second fluid to the first surface area, to the second surface area and/or to a surface area of the solidified first fluid, after solidification of the first fluid applied to the first surface area, wherein applying the second fluid includes applying a positive pressure, a plasma action and/or a compression molding, and wherein the second fluid wets the second surface area.

Systems for LED illumination products. Solutions to the problems attendant to delivering a white-appearing LED product without diminishing efficiency of white light generation are presented. Devices are designed and manufactured that include a specially-formulated off-state white-appearing layer to the LED apparatus. The composition of the specially-formulated off-state white-appearing layer is tuned for high-efficiency during the on-state.

An electro-optic modulator includes a doped semiconductor crystal having a crystallographic surface having an amplitude modulation orientation, a first metal electrode located on a first surface of the doped semiconductor crystal, a second metal electrode located on a second surface of the doped semiconductor crystal, and accumulation space charge regions located within surface regions of the doped semiconductor crystal that are proximal to the first metal electrode and the second metal electrode and including excess charge carriers of a same type as majority charge carriers of the doped semiconductor crystal.

Disclosed are an LED chip structure and its manufacturing method, and a mass transfer method applying the LED chip structure. The LED chip structure includes a substrate, a light emitting unit connected to the substrate, a passivation layer, an ohmic contact layer, and a metal layer formed at the junction of the light emitting unit and the substrate. The passivation layer surrounds the periphery of the light emitting unit and is connected to the metal layer, and the ohmic contact layer is covered onto the passivation layer and connected to the light emitting unit. The LED chip structure has the features of reasonable design and convenient transfer; the manufacturing method has the features of simple manufacture process, easy manufacture, and compact LED chip structure; and the mass transfer method applying the LED chip structure has the features of simple operation, easy alignment, and convenient transfer.

Systems for LED illumination products. Solutions to the problems attendant to delivering a white-appearing LED product without diminishing efficiency of white light generation are presented. Devices are designed and manufactured that include a specially-formulated off-state white-appearing layer to the LED apparatus. The composition of the specially-formulated off-state white-appearing layer is tuned for high-efficiency during the on-state.

An electro-optic modulator includes a doped semiconductor crystal having a crystallographic surface having an amplitude modulation orientation, a first metal electrode located on a first surface of the doped semiconductor crystal, a second metal electrode located on a second surface of the doped semiconductor crystal, and accumulation space charge regions located within surface regions of the doped semiconductor crystal that are proximal to the first metal electrode and the second metal electrode and including excess charge carriers of a same type as majority charge carriers of the doped semiconductor crystal.