Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 μA/μm.sup.2; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.

An embodiment of a qubit tuning device includes a first layer configured to generate a magnetic field, the first layer comprising a material exhibiting superconductivity in a cryogenic temperature range. In an embodiment, the qubit tuning device includes a qubit of a quantum processor chip, wherein the first layer is configured to magnetically interact with the qubit such that a first magnetic flux of the first layer causes a first change in a first resonance frequency of the qubit by a first frequency shift value.

The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.

Josephson junctions (JJ) may replace primary inductance of transformers to realize galvanic coupling between qubits, advantageously reducing size. A long-range symmetric coupler may include a compound JJ (CJJ) positioned at least approximately at a half-way point along the coupler to advantageously provide a higher energy of a first excited state than that of an asymmetric long-range coupler. Quantum processors may include qubits and couplers with a non-stoquastic Hamiltonian to enhance multi-qubit tunneling during annealing. Qubits may include additional shunt capacitances, e.g., to increase overall quality of a total capacitance and improve quantum coherence. A sign and/or magnitude of an effective tunneling amplitude Δ.sub.eff of a qubit characterized by a double-well potential energy may advantageously be tuned. Sign-tunable electrostatic coupling of qubits may be implemented, e.g., via resonators, and LC-circuits. YY couplings may be incorporated into a quantum anneaier (e.g., quantum processor).

Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.

The present disclosure discloses a device and a method for fabricating a superconducting circuit including a superconducting qubit. The superconducting circuit comprises a bottom electrode interconnecting a superconducting qubit and a first part of the superconducting circuit. The bottom electrode comprises a bottom electrode of the superconducting qubit and a bottom electrode of the first part of the superconducting circuit. The bottom electrode of the superconducting qubit and the bottom electrode of the first part of the superconducting circuit are formed in a first superconducting layer.

Josephson junction (JJ) structures are disclosed. In some embodiments, a JJ structure may include a first superconducting structure and a second superconducting structure disposed on a plane parallel to a silicon wafer surface. A non-superconducting structure may be disposed between the first superconducting structure and the second superconducting structure. A direction of current flow through the non-superconducting structure may be parallel to the silicon wafer surface.

A system and method for placing Josephson junction splitters on a superconducting circuit layout receives a specification of locations to be connected by a number of Josephson transmission lines. The system determines, based on the specification, a topology specifying connections between the locations, the topology including a plurality of 1-to-2 Josephson junction splitter nodes. The system determines splitter node locations based at least on ranges determined from distances between adjacent range endpoints of a previous level of the topology, and the system places each of the 1-to-2 Josephson junction splitter nodes at the determined splitter node locations.

Methods, systems and apparatus for implementing a tunable qubit coupler. In one aspect, a device includes: a first data qubit, a second data qubit, and a third qubit that is a tunable qubit coupler arranged to couple to the first data qubit and to couple to the second data qubit such that, during operation of the device, the tunable qubit coupler allows tunable coupling between the first data qubit and the second data qubit.

Systems and techniques providing suitable chip structures for facilitating antenna-based thermal annealing of qubits are provided. In one example, a radio frequency emitter can comprise a voltage-controlled oscillator and an antenna. The voltage-controlled oscillator can receive power-on signals from a microcontroller, thereby causing the voltage-controlled oscillator to generate an electromagnetic wave. The antenna can then direct the electromagnetic wave onto a set of one or more capacitor pads of a Josephson junction on a superconducting qubit chip, thereby annealing the Josephson junction. In another example, a voltage regulator and a digital-to-analog converter or digital-to-digital converter can be coupled in series between the microcontroller and the voltage-controlled oscillator, thereby allowing the voltage-controlled oscillator to be voltage and/or frequency tunable and eliminating the need for external power routing as compared to photonic laser annealing. In yet another example, a bipolar-junction and complementary metal-oxide semiconductor stack construction can be employed.