A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.

A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.

A reusable joint for a medical linac, a reusable CF choke flange for a medical linac, a linac and a method for forming a reusable joint for a medical linac are disclosed. The reusable joint comprises a CF choke flange, a CF cover flange and a gasket. The CF choke flange comprises a first waveguide aperture, a choke groove and a first CF groove comprising a first knife-edge, wherein the choke groove is disposed radially inwards from the first CF groove on the CF choke flange. The CF cover flange comprises a second waveguide aperture aligned with the first waveguide aperture and a second CF groove comprising a second knife-edge and aligned with the first CF groove. The gasket is disposed between and in contact with the first CF groove and the second CF groove.

Techniques for creating a low pass filter associated with a flux line are presented. A qubit device can comprise a first substrate and second substrate. A low pass filter, comprising at least one inductor and at least one capacitor can be formed, wherein respective components of or associated with the low pass filter can be formed on the first or second substrates, and wherein one or more bump bonds can extend between the substrates to connect respective components that are on respective substrates. The filter can receive an input signal via an input line and filter the signal to produce a filtered signal as output to a flux line that is in proximity to a coupler with SQUID loop and one or more flux-tunable qubits that are formed on one of the substrates. The filter can reduce electrical noise and Purcell decay associated with the flux line.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

A wireless communication system including an electrically conductive passive medium capable of simultaneously propagating therealong electromagnetic first and second currents at different respective frequencies F1 and F2, the electrically conductive passive medium including an electrically conductive first passive linear medium portion adjacent an electrically conductive first passive nonlinear medium portion, the first passive nonlinear medium portion capable of generating an intermodulation current based on a nonlinear interaction between the first and second currents, the intermodulation current having a frequency Fi equal to nF1+mF2 and propagating along the first passive nonlinear medium portion, m and n being positive or negative integers; and a first magnetic film disposed proximate an electrically conductive external surface of the first linear medium portion, such that when the first and second currents propagate along the first passive linear medium portion toward the first passive nonlinear medium portion, the magnetic film reduces or prevents the generation of the intermodulation current in the first passive nonlinear medium portion by attenuating at least portions of the first and second currents.

A wireless communication system including an electrically conductive passive medium capable of simultaneously propagating therealong electromagnetic first and second currents at different respective frequencies F1 and F2, the electrically conductive passive medium including an electrically conductive first passive linear medium portion adjacent an electrically conductive first passive nonlinear medium portion, the first passive nonlinear medium portion capable of generating an intermodulation current based on a nonlinear interaction between the first and second currents, the intermodulation current having a frequency Fi equal to nF1+mF2 and propagating along the first passive nonlinear medium portion, m and n being positive or negative integers; and a first magnetic film disposed proximate an electrically conductive external surface of the first linear medium portion, such that when the first and second currents propagate along the first passive linear medium portion toward the first passive nonlinear medium portion, the magnetic film reduces or prevents the generation of the intermodulation current in the first passive nonlinear medium portion by attenuating at least portions of the first and second currents.

A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.

A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.