The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A dielectric waveguide filter includes first resonant cavities, which are connected to form upper resonant cavities, and second resonant cavities, which are connected to form lower resonant cavities, wherein the upper and lower resonant cavities are correspondingly overlapped; each of the first resonant cavities has a first window coupling structure, wherein the first window coupling structure includes a first window opened at a position where the magnetic field distribution of a high-order mode in each of the first resonant cavities is the weakest, and/or a second window opened at a position where the electric field distribution of the high-order mode in each of the first resonant cavities is the strongest; and each of the second resonant cavities has a second window coupling structure corresponding to the first window coupling structure, and the first and second window coupling structures cooperate to eliminate the high-order modes of the dielectric waveguide filter.

A dielectric waveguide filter includes first resonant cavities, which are connected to form upper resonant cavities, and second resonant cavities, which are connected to form lower resonant cavities, wherein the upper and lower resonant cavities are correspondingly overlapped; each of the first resonant cavities has a first window coupling structure, wherein the first window coupling structure includes a first window opened at a position where the magnetic field distribution of a high-order mode in each of the first resonant cavities is the weakest, and/or a second window opened at a position where the electric field distribution of the high-order mode in each of the first resonant cavities is the strongest; and each of the second resonant cavities has a second window coupling structure corresponding to the first window coupling structure, and the first and second window coupling structures cooperate to eliminate the high-order modes of the dielectric waveguide filter.

The present invention relates to a radio frequency filter employing a notch structure, wherein the notch structure is a dual notch structure which comprises: a C notch structure formed in a predetermined region at a partition between two cavities to be cross-coupled; and an L notch structure formed together with the C notch structure in a predetermined region at a partition between two cavities.

The present invention relates to an RF filter assembly for an antenna. Particularly, the RF filter assembly for an antenna comprises: a main board on which a plurality of electronic components are mounted; a plurality of RF filters which are installed on one surface of the main board; and a filter support member which is disposed between the main board and the plurality of RF filters, is made of a metal material, and separates each of the plurality of RF filters in the direction of the one surface of the main board. Thereby, the present invention provides advantages of preventing the occurrence of cracks in solder cream caused by differences in thermal expansion coefficients between the main board and each RF filter, and also, enabling a more precise RF filter arrangement, and improving product reliability.

Filter devices are provided herein. In some embodiments, a filter device includes first and second resonator stalks in respective first and second openings in a PCB that has first and second metal resonator heads that are on the first and second resonator stalks, respectively. Moreover, in some embodiments, a filter device includes a metal resonator head that has a loop portion on a resonator stalk and a plurality of arms that extend outward from the loop portion.

Filter devices are provided herein. In some embodiments, a filter device includes first and second resonator stalks in respective first and second openings in a PCB that has first and second metal resonator heads that are on the first and second resonator stalks, respectively. Moreover, in some embodiments, a filter device includes a metal resonator head that has a loop portion on a resonator stalk and a plurality of arms that extend outward from the loop portion.

The present invention relates to an RF filter assembly for an antenna and, particularly, comprises: a plurality of band pass filters (BPFs); a filter board which is arranged to be stacked on the front surface of a main board and which mediate the coupling of the band pass filters for the front surface of the main board; low pass filters (LPFs) intaglio- or embossed-printed on front surface of the filter board; and an air layer formation pad arranged between the filter board and the band pass filters to form a predetermined air layer between the front surface of the filter board and rear surfaces of the band pass filters, and thus the overall performance of a filter product can be improved by minimizing insertion loss of a filter.

The present invention relates to an RF filter assembly for an antenna and, particularly, comprises: a plurality of band pass filters (BPFs); a filter board which is arranged to be stacked on the front surface of a main board and which mediate the coupling of the band pass filters for the front surface of the main board; low pass filters (LPFs) intaglio- or embossed-printed on front surface of the filter board; and an air layer formation pad arranged between the filter board and the band pass filters to form a predetermined air layer between the front surface of the filter board and rear surfaces of the band pass filters, and thus the overall performance of a filter product can be improved by minimizing insertion loss of a filter.

A radio-frequency assembly is described which can be used in communication satellites, for example. The radio-frequency assembly contains a signal source in the form of a semiconductor amplifier output, an impedance matching filter, and a radio-frequency waveguide. The impedance matching filter is connected to the semiconductor amplifier output on the input side and to the radio-frequency waveguide on the output side. The impedance matching filter has a different impedance value on the input side from that on the output side and is matched to the semiconductor amplifier output on the input side and matched to the radio-frequency waveguide on the output side. Consequently, a separate matching circuit between semiconductor amplifier output and radio-frequency waveguide is no longer necessary.