The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A dielectric waveguide filter includes first resonant cavities, which are connected to form upper resonant cavities, and second resonant cavities, which are connected to form lower resonant cavities, wherein the upper and lower resonant cavities are correspondingly overlapped; each of the first resonant cavities has a first window coupling structure, wherein the first window coupling structure includes a first window opened at a position where the magnetic field distribution of a high-order mode in each of the first resonant cavities is the weakest, and/or a second window opened at a position where the electric field distribution of the high-order mode in each of the first resonant cavities is the strongest; and each of the second resonant cavities has a second window coupling structure corresponding to the first window coupling structure, and the first and second window coupling structures cooperate to eliminate the high-order modes of the dielectric waveguide filter.

A radio-frequency device comprising (1) an input resonator configured to receive an input signal, (2) an output resonator configured to provide an output signal, and (3) a plurality of signal paths coupled between the input resonator and the output resonator, wherein each signal path included the plurality of signal paths comprises a bandpass filter that (A) is at least partially composed of a ceramic material and (B) has a bandpass center frequency different from every other signal path included in the plurality of signal paths. Various other apparatuses, systems, and methods are also disclosed.

A phased array antenna includes multiple antenna elements where each antenna element is an antenna apparatus that includes an antenna integrated with a filter. Each antenna apparatus includes a plurality of resonators where at least some of the resonators are each enclosed in a metal cavity and at least one resonator is exposed to free space to form a radiator element. Each antenna apparatus has a filter transfer function that is at least partially determined by dimensions of the radiator element and the position of the radiator element within the antenna apparatus. The scan volume of the phased array antenna is dependent on at least one physical dimension of the filter of the antenna apparatus.

A radio frequency (RF) waveguide comprising a channel, a filter, and a support bridge. The channel can comprise an outer wall defining an inner cavity configured to propagate electromagnetic waves. The filter can be disposed in the inner cavity of the channel and can comprise a perimeter edge and an aperture. The support bridge can comprise a first interface connected to an inner surface of the outer wall at a first location, and a second interface connected to the filter at a position between the perimeter edge and the aperture of the filter to support the filter within the channel. The support bridge can remain in place as connected to the filter, and the filter and waveguide can operate without interference from the support bridge, meaning that the waveguide meets all performance specifications and functions as intended for a particular application even with the support bridge left in place.

Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.

Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.

The present disclosure relates to a transition system, which includes a monolithic microwave integrated circuit (MMIC) package and a printed-circuit-board (PCB) with a number of PCB vias. The MMIC package has a laminate-based body, which includes a substrate integrated waveguide (SIW) structure with a number of SIW vias, and a MMIC die over the laminate-based body. Herein, the SIW structure faces the PCB and is separate from the PCB with a gap in between. The SIW structure is configured to radiate radio frequency (RF) signals received from the MMIC die to the PCB. An arrangement of the PCB vias is scaling-mirrored to an arrangement of the SIW vias, such that each PCB via and a corresponding SIW via have a same relative position. The arrangement of PCB vias is about aligned with the arrangement of the SIW vias.

A band pass filter includes a dielectric substrate, conductor plates, a ground via, waveguide resonators, and a trap resonator. The conductor plates are inside the dielectric substrate and opposed to each other. The ground via connects the conductor plates together. The waveguide resonators are coupled in series in a space between the conductor plates along a principal coupling path from an input terminal to an output terminal. Waveguide resonators adjacent along the principal coupling path are subjected to inductive coupling. The trap resonator couples waveguide resonators in two pairs included in the waveguide resonators as jumping over a portion of the principal coupling path, and capacitive couples the waveguide resonators included in each of the pairs.

A multi-layer signal filter includes at least three physical layers. Each layer has through going apertures arranged with an offset to apertures of at least one adjoining layer, each layer further has a filter channel opening for receiving signals to be filtered. The apertures are arranged along a perimeter outside the filter channel opening and the apertures are arranged with a central surface portion increasing the edge length of the aperture.