An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A waveguide based variable attenuator device including one or more attenuators each including a porous dielectric material; and a metal coating on the top of the dielectric material; and an actuator coupled to the attenuator. The actuator is configured to position, with nanometer resolution, the one or more attenuators in a waveguide configured and dimensioned to guide an electromagnetic wave having a frequency in a range of 100 gigahertz (GHz) to 1 terahertz (THz). The actuator controls at least one of a position or a volume of the one attenuator inserted in the waveguide to achieve a variable or pre-determined attenuation of the electromagnetic wave transmitted through waveguide.

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

An attenuation apparatus and a test system. The attenuation apparatus includes a signal transmission channel and at least one radiation loss structure, wherein the signal transmission channel is configured to perform transmission attenuation on the energy of a transmitted signal; the radiation loss structure is arranged in the signal transmission channel; the radiation loss structure has a first operating state and a second operating state; when the radiation loss structure is in the first operating state, the radiation loss structure is configured to perform radiation attenuation on the energy of a signal transmitted by the signal transmission channel; and when the radiation loss structure is in the second operating state, the radiation loss structure is configured to perform transmission attenuation on the energy of the signal transmitted by the signal transmission channel.

Provided is a divider capable of accurately evaluating an object to be measured without being affected by impedance of a terminal to be measured of the object to be measured, and a signal generation system. There is provided a divider including an input terminal, a plurality of output terminals, a distribution unit that distributes a high frequency signal input to the input terminal and outputs signals obtained by the distribution, and a plurality of reflected wave blocking units that are respectively connected to a plurality of distribution unit outputs and attenuate reflected waves reflected by sides of the plurality of output terminals. The distribution unit includes the plurality of distribution unit outputs and outputs the high frequency signal distributed from the plurality of distribution unit outputs. Outputs from the plurality of reflected wave blocking units are output from the plurality of output terminals.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

A film includes a substrate having a planar surface attachable to a surface that transmits electromagnetic energy; and a photonic crystal structure formed in the planar substrate that alters the transmitted electromagnetic energy.

A signal level control element comprises a substrate having conductive formations defining a substrate integrated wave-guide arrangement disposed at least partly within the substrate; the substrate integrated waveguide arrangement providing a quadrature hybrid coupler having first and second pairs of signal ports, such that a signal introduced to a port of one pair of the first and second pairs is provided with equal amplitude but a 90 degree phase difference to both ports of the other pair of the first and second pairs; in which a port of the first pair is configured to receive an input signal and the other port of the first pair is configured to provide an output signal; and termination circuitry connected to the ports of the second pair, the termination circuitry providing, for each port of the second pair, a respective termination having a variable impedance dependent upon a respective control signal.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.