A high-frequency coaxial attenuator includes a first coaxial cable portion that includes a first center conductor having a first length, and a first insulator of the first length formed around the first center conductor, wherein the first center conductor and the first insulator form a first diameter. A second coaxial cable portion is separated from the first coaxial cable portion by a gap. The second coaxial cable portion includes a second center conductor having a second length, and a second insulator of the second length formed around the second center conductor. A semiconductor material is deposited in the gap between the first coaxial cable portion and the second coaxial cable portion. The semiconductor material may be configured to provide an impedance of 500Ω and provides 20 dB of attenuation, and a 10:1 voltage divider based on a 50Ω input impedance of test equipment.

A high-frequency coaxial attenuator includes a first coaxial cable portion that includes a first center conductor having a first length, and a first insulator of the first length formed around the first center conductor, wherein the first center conductor and the first insulator form a first diameter. A second coaxial cable portion is separated from the first coaxial cable portion by a gap. The second coaxial cable portion includes a second center conductor having a second length, and a second insulator of the second length formed around the second center conductor. A semiconductor material is deposited in the gap between the first coaxial cable portion and the second coaxial cable portion. The semiconductor material may be configured to provide an impedance of 500Ω and provides 20 dB of attenuation, and a 10:1 voltage divider based on a 50Ω input impedance of test equipment.

An attenuator comprising a first thermal reservoir and a first metal layer located on top of the first thermal reservoir. A first dielectric layer located on top of the first metal layer and a resistor located on top the first dielectric layer. A second dielectric layer located on top of the resistor and a second metal layer located on top of the second dielectric layer. A second thermal reservoir located on top the third metal layer and wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.

A flexible resistive tip cable assembly includes a probe Radio Frequency (RF) connector structured to receive a RF differential signal and a testing connection assembly. A coaxial cable is structured to conduct the RF differential signal between the probe RF connector and the testing connection assembly. The coaxial cable includes a cable for conducting the differential signal, and a plurality of magnetic elements positioned along a length of the cable and structured to isolate the differential signal from common mode interference. The magnetic elements are separated from adjacent magnetic elements by a gap with elastomeric elements is positioned in each gap to provide cable flexibility. The assembly may also include an Electrically Erasable Programmable Read Only Memory (EEPROM) loaded with an attenuation associated with the flexible resistive tip cable assembly for use in signal testing by a device coupled to the testing connection assembly.

A transmission device includes a coupler configured to convert a transmit signal to transmitted guided electromagnetic waves that propagate along a surface of a transmission medium without requiring an electrical return path, the coupler further configured to convert to a receive signal, received guided electromagnetic waves that propagate along the surface of the transmission medium without requiring an electrical return path. A housing is configured to provide environmental protection to the coupler. The housing includes an aperture section configured to pass the transmitted guided electromagnetic waves from the coupler through an aperture side of the housing, the aperture section further configured to pass the received guided electromagnetic waves to the coupler through the aperture side of the housing. The housing also includes a non-aperture section configured to absorb radio frequency (RF) signals in a frequency range of the transmit signal and a frequency range the receive signal.

A device for preventing a signal induced by hazardous EMI on a power line in a group of multiple adjacent, parallel power lines of the same phase in an electrical power system from reaching an electrical component connected to one of the multiple power lines, the device comprising at least one conductive impedance transition element having a disk-shaped structure with multiple holes for receiving the multiple adjacent power lines of the same phase, the disk-shaped structures each having an outer diameter that is greater than diameter of all of the multiple parallel power lines to deliberately create an impedance mismatch between the conductive impedance transition elements and adjacent portions of the multiple power lines. The impedance mismatch causes the conductive impedance transition elements to reflect high-frequency components of a signal induced on the multiple power lines by hazardous EMI and the high-frequency components are reflected and dissipated as heat.

A transmission device includes a coupler configured to convert a transmit signal to transmitted guided electromagnetic waves that propagate along a surface of a transmission medium without requiring an electrical return path, the coupler further configured to convert to a receive signal, received guided electromagnetic waves that propagate along the surface of the transmission medium without requiring an electrical return path. A housing is configured to provide environmental protection to the coupler. The housing includes an aperture section configured to pass the transmitted guided electromagnetic waves from the coupler through an aperture side of the housing, the aperture section further configured to pass the received guided electromagnetic waves to the coupler through the aperture side of the housing. The housing also includes a non-aperture section configured to absorb radio frequency (RF) signals in a frequency range of the transmit signal and a frequency range the receive signal.

A device for preventing a signal induced by hazardous EMI on a power line in a group of multiple adjacent, parallel power lines of the same phase in an electrical power system from reaching an electrical component connected to one of the multiple power lines, the device comprising at least one conductive impedance transition element having a disk-shaped structure with multiple holes for receiving the multiple adjacent power lines of the same phase, the disk-shaped structures each having an outer diameter that is greater than diameter of all of the multiple parallel power lines to deliberately create an impedance mismatch between the conductive impedance transition elements and adjacent portions of the multiple power lines. The impedance mismatch causes the conductive impedance transition elements to reflect high-frequency components of a signal induced on the multiple power lines by hazardous EMI and the high-frequency components are reflected and dissipated as heat.

A transmission device includes a coupler configured to convert a transmit signal to transmitted guided electromagnetic waves that propagate along a surface of a transmission medium without requiring an electrical return path, the coupler further configured to convert to a receive signal, received guided electromagnetic waves that propagate along the surface of the transmission medium without requiring an electrical return path. A housing is configured to provide environmental protection to the coupler. The housing includes an aperture section configured to pass the transmitted guided electromagnetic waves from the coupler through an aperture side of the housing, the aperture section further configured to pass the received guided electromagnetic waves to the coupler through the aperture side of the housing. The housing also includes a non-aperture section configured to absorb radio frequency (RF) signals in a frequency range of the transmit signal and a frequency range the receive signal.

The technology described herein is directed towards microwave attenuators, and more particularly to a cryogenic microwave attenuator device for quantum technologies. In some embodiments, a device can comprise a cryogenic microwave attenuator device. The cryogenic microwave attenuator device can comprise: a housing component and a microwave attenuator chip, wherein the housing component can have thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin. The cryogenic microwave attenuator device can also comprise a microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip.