A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

An electronic device is provided that includes a board equipped with a pair of differential transmission lines that each have an opening extending between two line terminals. Moreover, the device includes a capacitor module that includes a support and two capacitors that each have two capacitor terminals, respectively, connected to the two line terminals of one line of the pair of transmission lines. In addition, the support includes a separating region between the two capacitors that has at least one cavity disposed between the two capacitors.

A transition unit of a radio frequency device provides a transition between a planar differential pair transmission line and a hollow radio frequency waveguide. It comprises a substrate layer arrangement with a planar differential pair transmission line arranged on one or more surfaces of at least one substrate layer, whereby an end section of the differential pair transmission line is configured as a radio frequency signal transition pattern. It further comprises an end section of a waveguide that is attached to the substrate layer arrangement and that superposes the radio frequency signal transition pattern. The waveguide is directed perpendicular to the substrate layer arrangement. An open end of the end section of the waveguide is attached to a first outer surface or a second outer surface of the substrate layer arrangement. The transition pattern comprises open loop shaped end sections of a first and second transmission line segment.

A waveguide structure includes a first waveguide section mechanically and electrically connected by a fixed connector to a second waveguide section. The waveguide sections include a dielectric material with a ground layer and a conductor structure with a pair of elongate conductors. The fixed connector includes a dielectric material with a pair of contact pads insulated from a ground layer. The fixed connector is attached by its top side to the bottom sides of interface sections of the waveguides sections forming a ground contact. The interface sections each comprise an intermediate conductor from each of the elongate conductors at the top side to the bottom side of the dielectric material. The intermediate conductors are connected via the contact pads.

A signal transmission circuit includes a printed circuit board including a surface layer including a signal transmission path that transmits a signal, a signal line through hole that connects the signal transmission path with a signal layer arranged in an inner layer of the printed circuit board, a ground layer of the inner layer of the printed circuit board that forms a return current transmission path for the signal transmission path, and a ground through hole that is connected to the ground layer adjacent to the signal line through hole. A ground pattern including ground areas disposed with a certain distance therebetween and a side ground area connected with at least one end side of the ground areas is disposed at positions of both sides of the signal transmission path. The ground through hole is disposed to connect the ground pattern with the ground layer.

A system includes a first quantum circuit plane that includes a first qubit, a second qubit and a third qubit. A coupled-line bus is coupled between the first qubit and the second qubit. A second circuit plane is connected to the first quantum circuit plane, comprising a control line coupled to the third qubit. The control line and the coupled-line bus are on different planes and crossing over each other, and configured to mitigate cross-talk caused by the crossing during signal transmission.