An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

The disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmission line structure of a wireless communication system is provided. The transmission line includes a ground area, a signal line, and a support. A first surface of the signal line is disposed to be spaced apart from the ground area via an air layer therebetween, a second surface of the signal line located opposite to the first surface may be coupled to the support, and the support may be coupled to the ground area.

This feeder line includes: a plate-shaped dielectric substrate; a first conductor pattern dividing a first surface of the dielectric substrate into a first area and a second area; a first-area ground conductor pattern formed in the first area; a second-area ground conductor pattern formed in the second area; a second-surface ground conductor pattern formed on a second surface; a second conductor pattern connecting the first conductor pattern and one or both of the first-area ground conductor pattern and the second-area ground conductor pattern; a plurality of conductors and connecting between the second-surface ground conductor pattern, and the first-area ground conductor pattern and the second-area ground conductor pattern; and a conductive member connecting the first-area ground conductor pattern and the second-area ground conductor pattern. A length of the second conductor pattern is an odd multiple of ¼ of a wavelength of a signal propagating through the first conductor pattern.

Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.

Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.

Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

RF transmission lines that include a conductive ground plane, a conductive strip that extends above the ground plane, one or more plastic strips disposed between the conductive ground plane and the conductive strip, the one or more plastic strips having a combined length that is at least half a length of the conductive strip, and a plurality of dielectric fasteners that maintain the conductive strip at a predetermined distance above the conductive ground plane.

A microwave transmission line assembly operated in vacuum for satellite antennas and beamforming networks comprising a first ground plane and a conductor strip positioned a distance from the first ground plane. The conductor strip comprises a first strip portion and a second strip portion (6). The first strip portion is positioned at a first distance from the first ground plane and wherein the second strip portion is positioned at a second distance from the first ground plane. The first distance is smaller than the second distance, wherein the first distance is chosen to avoid multipaction.

Enhanced air core transmission lines and transformers are disclosed. A transmission line or transformer is disposed on a dielectric substrate, with a first planar conductor on the dielectric substrate and a second planar conductor suspended above the first planar conductor. A set of support posts suspends the second planar conductor above the first planar conductor. Thermal performance of the transmission line or transformer is improved by having each of the set of support posts include a width which exceeds any gap between support posts. In some examples, openings are formed in the second planar conductor and may facilitate etching or other processes of forming the transmission line or transformer.