Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.

Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

A reconfigurable antenna, includes an emissive region, including at least one radiating source designed to emit electromagnetic waves; and an electromagnetic lens, including a set of phase-shifting cells, including switches configured to introduce a phase shift to the electromagnetic waves, and bias lines to bias the switches. The antenna further includes an electromagnetic coupling region, arranged between the emissive region and the electromagnetic lens in order to generate electromagnetic coupling between the electromagnetic waves and the set of phase-shifting cells, wherein the electromagnetic coupling region comprises a set of electrically conductive elements, arranged to form a contour of a resonant cavity guiding the electromagnetic waves towards the electromagnetic lens, the set of electrically conductive elements comprising first tracks electrically connected to the bias lines.

A radio frequency module includes a first substrate having a first principal surface and a second principal surface on the opposite side to the first principal surface; a signal terminal which is provided on the first principal surface and through which a signal is transmitted to and received from an external circuit; a power supply terminal that is provided on the second principal surface and is supplied with a power supply signal; an antenna; and a radio frequency electronic component that is electrically connected to the signal terminal, the power supply terminal and the antenna, and controls transmission and reception of the antenna based on the signal and the power supply signal.

Arranged on a surface of a substrate are a patch conductor that radiates an electromagnetic field having been fed, a feed line that feeds the patch conductor with the electromagnetic field having been input, two slits parallel to the feed line on both sides of a connection part of the feed line toward an inner side of the patch conductor, and a ring conductor at a space from the patch conductor with an interposition of a gap to surround an outer periphery of the patch conductor. Accordingly, an electric capacitance can be formed between the patch conductor and the ring conductor, and when achieving impedance matching with the feed line, adjustment can be performed using the size of the ring conductor and the gap.

An efficient, low-profile, lightweight fixed-beam (constant angle of departure) aperture antenna. The aperture antenna includes an array of horn radiators coupled to a waveguide diplexer by means of a stripline distribution network. The stripline distribution network is embedded in a printed wiring board (PWB), which PWB is sandwiched between a radiator plate (incorporating the horn radiators) and a diplexer plate. The aperture antenna may further include a backside ground plane made of metal. The diplexer plate and backside cover plate are configured to form the waveguide diplexer. Each horn radiator has a respective circular opening at one end adjacent to the PWB. The diplexer plate includes an array of circular waveguide backshorts which are congruent and respectively aligned with the circular openings of the horn radiators. The radiator plate further includes a rectangular waveguide backshort which is congruent and aligned with a rectangular port of the diplexer plate.

A stack for fabricating an integrated circuit intended to perform an electromagnetic-lens function for a reconfigurable transmitarray antenna, the stack including in succession: a substrate that includes a set of first active components configured to generate a phase shift, and that has first and second opposite surfaces, the first active components being integrated monolithically into the substrate; a metal layer, forming a ground plane on the first surface of the substrate; a layer of a cured polymer, formed on the metal layer; vias that are electrically insulated from the metal layer and that are arranged to electrically connect pairs of planar antennas, each electrically connected pair of planar antennas including first and second planar antennas that are aligned along the normal to the first and second surfaces of the substrate.