A flat-conductor connection element for an electrically conductive structure applied to a pane, includes at least one conductor, containing a flat conductor, having a first connection region at a first end and a second connection region at a second end, the first connection region having a connection surface for electrically connecting to the electrically conductive structure and having a contact surface opposite the connection surface for contact with a soldering tool; an encapsulation layer made of an electrically insulating material, which encapsulation layer surrounds the conductor at least in a conductor portion containing the first connection region, the encapsulation layer having a through-hole, through which the connection surface and the contact surface of the first connection region are accessible, the first connection region of the conductor being within the through-hole in a view perpendicularly through the plane of the encapsulation layer.

A flat-conductor connection element for an electrically conductive structure applied to a pane, includes at least one conductor, containing a flat conductor, having a first connection region at a first end and a second connection region at a second end, the first connection region having a connection surface for electrically connecting to the electrically conductive structure and having a contact surface opposite the connection surface for contact with a soldering tool; an encapsulation layer made of an electrically insulating material, which encapsulation layer surrounds the conductor at least in a conductor portion containing the first connection region, the encapsulation layer having a through-hole, through which the connection surface and the contact surface of the first connection region are accessible, the first connection region of the conductor being within the through-hole in a view perpendicularly through the plane of the encapsulation layer.

An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.

An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.

A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.

A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.

The present disclosure relates to a cable connector structure, which includes a housing, a tongue plate, a plurality of cables, and a plurality of heat sinks. The housing includes a docking end and a butting end. One side of the housing includes a top surface, and the top surface protrudingly provided with a hollow stage. The tongue plate is arranged in the housing, one end of the tongue plate is provided with a docking area, and the other end of the tongue plate is provided with a welding area. The plurality of heat sinks is arranged on the top surface of the housing, the hollow stage is arranged toward the docking end and the plurality of heat sinks are arranged toward the butting end.

A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.

A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.

Flexible electrical connectors are provided to electrically connect electronic devices. The flexible electrical connector includes a removable adhesive tape strip having an adhesive surface thereof and an electrically conductive trace disposed on the adhesive tape strip. The flexible electrical connector engages an electronic device to form an electrical contact where the adhesive tape strip has an adhesive surface removably adhesively bonded to the substrate of the electronic device to at least partially cover the electrical contact.