Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.

A circuit board assembly includes a circuit board and an electrical connector having a connector housing holding contacts in a contact array. The connector housing has a mating end configured to be mated with a mating electrical connector in a mating direction. The electrical connector has cables terminated to the contacts and extending from a cable end. A connector mount is used to locate the electrical connector relative to the circuit board. A bracket is coupled to the mounting surface of the circuit board. A biasing member is coupled to the bracket and the mounting feature and is compressible along a compression axis parallel to the mating direction to allow the electrical connector to float in the mating direction relative to the circuit board.

An apparatus includes a memory module socket having a base end and a branching point. The base end is coupled to a printed circuit board (PCB). The branching point is external to the PCB. A first branch extends from the branching point at an angle θ1, where 90 degrees≦θ1<180 degrees, and a second branch extends from the branching point at an angle θ2, where 90 degrees≦θ2<180 degrees. A method includes signaling between the PCB and a first memory module and a second memory module via a base end of the memory module socket. The memory module socket connects to the PCB via the base end. The signaling is branched at a branching point of the memory module socket to the first memory module via a first branch and to the second memory module via a second branch. The branching is external to the PCB.

A connection apparatus includes: a housing case, where the housing case includes a first side face and a second side face that are intersected and disposed adjacent to each other; a first connector, disposed on the first side face and configured to be connected to a connector of a first line card, so that the connection apparatus is orthogonally connected to the first line card; and a second connector, disposed on the second side face and connected to the first connector. The second connector is configured to be connected to a connector of a network board. The connection apparatus can improve a capacity of the communications device.

An electrical connector electrically connects a first electrical module and a second electrical module, for insertion by the first electrical module along a first direction. The electrical connector includes a first group of terminals arranged in a row along a second direction, having multiple signal terminals and multiple ground terminals and forming at least one first terminal unit and at least one second terminal unit. Each of the terminals has a contact portion, a tail portion, and a middle portion located between the contact portion and the tail portion. In the second direction, the middle portions of the first terminal unit form a first row of the middle portions, and the middle portions of the second terminal unit form a second row of the middle portions. Viewing from the second direction, the first and second rows of the middle portions are staggered, thus improving the crosstalk.

A drive loading jig, drive carrier assembly and method of using the same to insert and remove a drive from a host reduce the likelihood of a drive being damaged during insertion or removal. Such a drive loading jig has side walls with respective slots and a rear wall joining the side walls. Each of the slots includes multiple restraining walls to restrain a drive, when positioned in the jig, from bending with respect to a plane parallel to a major surface of the drive and from moving in a direction substantially perpendicular to the major surface. Stoppers formed in the side walls or rear wall define a maximum insertion depth of the drive. An alignment key-way on the loading jig is used to align the drive in the proper orientation prior to inserting the drive into the loading jig.

A header assembly includes a header housing having a header cavity. The header assembly includes header signal contacts received in corresponding signal contact channels having mating ends arranged in the header cavity for mating with the receptacle assembly. The header assembly includes header ground contacts received in corresponding ground contact channels. Each header ground contact includes shield walls forming a shield cavity receiving header signal contacts to provide electrical shielding for the header signal contacts. The shield walls include an end wall extending between first and second side walls. Each header ground contact includes a mating protrusion that extends outward relative to the shield cavity from the corresponding shield wall. The mating protrusion is configured to engage a conductive insert of the receptacle assembly used to electrically common each of the header ground contacts.

An interface card is provided with an oblique-insert-proof structure. The interface card has an inserting portion configured to be inserted into a slot of a motherboard. The oblique-insert-proof structure is configured to abut the slot. The oblique-insert-proof structure has a connecting portion and two end blocking portions. The connecting portion has a groove in an inserting direction and extending in a length direction. The end blocking portions are configured to abut two shorter side surfaces of the slot. The oblique-insert-proof structure is securely mounted on the interface card and the inserting portion is mounted through the groove. When the interface card is mounted on the motherboard, the oblique-insert-proof structure can assist in aligning the inserting portion with the slot. Also, the oblique-insert-proof structure can enhance the strength of the connection between the interface card and the motherboard, so the interface card can be disposed with more components and bear more weight.

A header assembly includes a header housing having a header cavity. The header assembly includes header signal contacts received in corresponding signal contact channels having mating ends arranged in the header cavity for mating with the receptacle assembly. The header assembly includes header ground contacts received in corresponding ground contact channels. Each header ground contact includes shield walls forming a shield cavity receiving header signal contacts to provide electrical shielding for the header signal contacts. The shield walls include an end wall extending between first and second side walls. Each header ground contact includes a mating protrusion that extends outward relative to the shield cavity from the corresponding shield wall. The mating protrusion is configured to engage a conductive insert of the receptacle assembly used to electrically common each of the header ground contacts.

An electrical connector according to an embodiment includes a plurality of signal contacts with an electrically conductive property, a housing with an insulation property, and a shell with an electrically conductive property. The plurality of signal contacts are arrayed along a first direction of the electrical connector and are held by the housing. The shell covers each of a plurality of outer surfaces of the housing that exclude a surface that faces a principal surface of a wiring substrate, and faces a connection part(s) that is/are connected to the wiring substrate on an outer surface of the housing and the plurality of signal contacts, with a gap(s), in a second direction that is a direction along the principal surface of the wiring substrate and is orthogonal to the first direction.