A display apparatus including: a display panel; a chassis assembly supporting the display panel; a printed circuit board accommodated in the chassis assembly, and configured to drive and control the display panel; and a connector installed on the printed circuit board, and including a seating portion and a connector terminal positioned on one side of the seating portion, wherein the connector is connected to the cable by seating a surface of a body of a cable on the seating portion in a vertical direction while the surface of the body of the cable faces the seating portion and contact-coupling a cable terminal formed at one end of the body of the cable with the connector terminal.

Provided is an electronic device including a first housing, a second housing, a flexible housing including a hinge structure, a first printed circuit board disposed in the first housing, a second printed circuit board disposed in the first housing, laminated on one surface of the first printed circuit board facing a second direction and including a connector on one surface facing the second direction, a flexible printed circuit board connected with the connector, extending from the second housing through the hinge structure to the first housing, a rib supporting the first printed circuit board, disposed between the first printed circuit board and a first surface, including a through hole through which part of the flexible printed circuit board passes, extending in the second direction from one end, and at least one sealing member sealing a space between the through hole and part of the flexible printed circuit board.

Disclosed are a flat cable and a WIFI connection line, where the flat cable includes flat wires and an insulation layer wrapped around the flat wires. The flat wires include one power line, four signal lines and two ground lines arranged at intervals, and a width of the power line and a width of each ground line are both greater than a width of each signal line.

A robot apparatus includes a clamp mechanism; a transport mechanism; and a control unit. The clamp mechanism includes a first finger that has a first support surface and a housing portion and a second finger. The first support surface supports an aligned wire group that includes a plurality of wires, the housing portion includes a guide wall that is connected to the first support surface and regulates an amount of movement of the band member in a width direction. The second finger has a second support surface facing the first support surface and a facing portion being connected to the second support surface and facing the housing portion. The transport mechanism is capable of moving the clamp mechanism. The control unit controls a grip force of the clamp mechanism and a direction of movement of the clamp mechanism by the transport mechanism.

A spring clip includes a first beam and a second beam connected to the first beam and resiliently deflectable toward the first beam from a relaxed position distal from the first beam to a compressed position proximal to the first beam. The second beam has a spring latch extending toward the first beam. The spring latch engages the first beam to secure the second beam in the compressed position. The clip may be positioned in a housing having a rotatable cover formed to compress the clip against a conductor when moved to a closed position.

A spring clip includes a first beam and a second beam connected to the first beam and resiliently deflectable toward the first beam from a relaxed position distal from the first beam to a compressed position proximal to the first beam. The second beam has a spring latch extending toward the first beam. The spring latch engages the first beam to secure the second beam in the compressed position. The clip may be positioned in a housing having a rotatable cover formed to compress the clip against a conductor when moved to a closed position.

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.

An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.