A terminal module includes a number of conductive terminals. Each conductive terminal includes a contact portion. The conductive terminals include differential signal terminals. Each differential signal terminal includes a first extending portion, a torsion portion, and a second extending portion perpendicular to the first extending portion. The differential signal terminals include a first signal terminal and a second signal terminal. Most of the two first extending portions of the differential signal terminals are narrow-side coupled, and small parts are wide-side coupled. The second extending portions of the differential signal terminals are narrow-sided coupled. The present disclosure also discloses a backplane connector having the terminal module. Compared with the prior art, the present disclosure can make the differential signal terminals tightly coupled, thereby stabilizing the insertion loss.

A terminal module includes a number of conductive terminals. Each conductive terminal includes a contact portion. The conductive terminals include differential signal terminals. Each differential signal terminal includes a first extending portion, a torsion portion, and a second extending portion perpendicular to the first extending portion. The differential signal terminals include a first signal terminal and a second signal terminal. Most of the two first extending portions of the differential signal terminals are narrow-side coupled, and small parts are wide-side coupled. The second extending portions of the differential signal terminals are narrow-sided coupled. The present disclosure also discloses a backplane connector having the terminal module. Compared with the prior art, the present disclosure can make the differential signal terminals tightly coupled, thereby stabilizing the insertion loss.

A mating terminal module includes a number of mating conductive terminals. Each mating conductive terminal includes a mating portion. The mating conductive terminals include a first mating signal terminal and a second mating signal terminal. The first mating signal terminal further includes a first connecting portion. The second mating signal terminal further includes a second connecting portion. The first connecting portion extends in a direction toward the second connecting portion, and the second connecting portion extends in a direction toward the first connecting portion. The present disclosure also discloses a mating backplane connector and a backplane connector assembly having the mating terminal module. Compared with the prior art, the present disclosure can achieve a better effect of impedance stabilization.

A mating terminal module includes a number of mating conductive terminals. Each mating conductive terminal includes a mating portion. The mating conductive terminals include a first mating signal terminal and a second mating signal terminal. The first mating signal terminal further includes a first connecting portion. The second mating signal terminal further includes a second connecting portion. The first connecting portion extends in a direction toward the second connecting portion, and the second connecting portion extends in a direction toward the first connecting portion. The present disclosure also discloses a mating backplane connector and a backplane connector assembly having the mating terminal module. Compared with the prior art, the present disclosure can achieve a better effect of impedance stabilization.

A PCIe/SAS connector structure includes a female part and a male part; the female part is engaged with the male part; wherein the female part has a female plastic member, a female cover, a female signal terminal part, a fix pin and a female signal and power terminal; wherein the male part has a male plastic member, a male cover, a male signal and power terminal, a male terminal, and a fix plate; wherein the female cover is in a full-wrap structure; wherein the female cover has a protruding elastic plate, respectively; wherein the male terminal is formed in an L shape; two male terminals are fixed as a set by a plastic; the male terminal is inserted to be positioned in the male cover; wherein the male cover is formed in an L shape in a full-wrap structure. Interference performance of signal terminal is improved.

A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.

A Peripheral Component Interconnect Express/Serial Attached SCSI (PSAS) female connector includes a frame member, a terminal member, and a cover member; the frame member including a terminal groove disposed in the frame member and a tilt portion disposed in the terminal groove adjacent to a plug end; the terminal member inserted in the frame member and including a Serial Advanced Technology Attachment (SATA) 7 pin terminal, a Serial Attached SCSI (SAS) 40 pin terminal, a 15 Pin signal terminal, a 6 Pin terminal, and a 4 Pin terminal. When the PSAS female connector is engaged with the male connector, the SATA 7 Pin terminal and the SAS 40 Pin terminal are pressed by a terminal of the male connector to be bent toward an outer lateral side of the terminal groove to contact the elastic plate of the cover member. The present invention effectively improves the cross interference during high speed transmission, thereby achieving the Generation 5 performance requirement.

A backplane connector includes a wafer and a mounting block. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a contact portion, a tail portion and a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield includes a first protruding piece. The second metal shield includes a second protruding piece. The mounting block includes a slot for passing through the tail portions of the differential signal terminals. The first protruding piece and the second protruding piece are at least partially inserted into the slot. This arrangement can provide better shielding adjacent to the tail portions of the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

A backplane connector includes a wafer and a mounting block. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a contact portion, a tail portion and a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield includes a first protruding piece. The second metal shield includes a second protruding piece. The mounting block includes a slot for passing through the tail portions of the differential signal terminals. The first protruding piece and the second protruding piece are at least partially inserted into the slot. This arrangement can provide better shielding adjacent to the tail portions of the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

A substrate configured to be mated with an electrical connector having improved performance data is achieved by reducing the length of the electrical signal contact pads of the substrate with respect to the length of electrical signal contact pads of conventional substrates that are configured to be mated with the electrical connector.