A technique for reducing jitter in an oscillating signal generated by an oscillator circuit includes reducing feedback of gate leakage current while increasing electrostatic discharge protection and reducing regulated power supply requirements of the oscillator circuit, as compared to conventional oscillator circuits. A circuit includes a first integrated circuit terminal and a thick gate native transistor of a first conductivity type having a first gate terminal having a first gate thickness. The first gate terminal is coupled to the first integrated circuit terminal. The thick gate native transistor has a first threshold voltage. The thick gate native transistor is configured as a source follower. The circuit includes a second transistor of the first conductivity type having a second gate terminal with a second gate thickness less than the first gate thickness. The second gate terminal is coupled to a source terminal of the thick gate native transistor.

In a crystal oscillator, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

In a crystal oscillator, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

In a crystal oscillator accordance to an embodiment, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

In a crystal oscillator accordance to an embodiment, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

A family of resonators and other devices which employ virtual electrodes using pixel based projection across a gap onto a material. In many embodiments, the pixels are projected onto a piezoelectric material, such as quartz crystal, by an integrated circuit die placed opposite a face of the crystal. The die projects individual pixels of electromagnetic energy onto the crystal, which vibrates and produces its own electromagnetic energy which is received by the pixels. Pixel projection onto other materials, including non-resonant materials, is also disclosed. The pixel based projected electrodes may be used in combination with, or in lieu of, conventional metal electrodes. Individual pixels may be turned on and off, and gain- and phase-controlled, in order to achieve specific desired resonator response characteristics. Many types of devices using pixel based electrode projection are disclosedincluding resonators having one or more electrodes, oscillators, filters, delay lines, antennas and others.

A technique for reducing jitter in an oscillating signal generated by an oscillator circuit includes reducing feedback of gate leakage current while increasing electrostatic discharge protection and reducing regulated power supply requirements of the oscillator circuit, as compared to conventional oscillator circuits. A circuit includes a first integrated circuit terminal and a thick gate native transistor of a first conductivity type having a first gate terminal having a first gate thickness. The first gate terminal is coupled to the first integrated circuit terminal. The thick gate native transistor has a first threshold voltage. The thick gate native transistor is configured as a source follower. The circuit includes a second transistor of the first conductivity type having a second gate terminal with a second gate thickness less than the first gate thickness. The second gate terminal is coupled to a source terminal of the thick gate native transistor.

A technique for reducing jitter in an oscillating signal generated by an oscillator circuit includes reducing feedback of gate leakage current while increasing electrostatic discharge protection and reducing regulated power supply requirements of the oscillator circuit, as compared to conventional oscillator circuits. A circuit includes a first integrated circuit terminal and a thick gate native transistor of a first conductivity type having a first gate terminal having a first gate thickness. The first gate terminal is coupled to the first integrated circuit terminal. The thick gate native transistor has a first threshold voltage. The thick gate native transistor is configured as a source follower. The circuit includes a second transistor of the first conductivity type having a second gate terminal with a second gate thickness less than the first gate thickness. The second gate terminal is coupled to a source terminal of the thick gate native transistor.