A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz

A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.

A multilayer substrate includes a via electrode defining and functioning as an end portion on ground terminals side of a first inductor connected to a shield electrode, the end portion on a signal line side is adjacent to or in a vicinity of a first principal surface than the end portion on the ground terminals side is in the lamination direction of base material layers, a via electrode defining and functioning as the end portion on the ground terminals side of a second inductor is connected to the shield electrode, and the end portion on the signal line side is adjacent to or in a vicinity of the first principal surface than the end portion on the ground terminals side is in the lamination direction of the base material layers.

An RF filter (BPF) with an increased bandwidth is provided. The filter comprises a half-lattice topology and a phase shifter (PS) comprising inductively coupled inductance elements in a parallel branch parallel to a first segment (S1) of a signal path (SP) between a first port (P1) and a second port (P2) of the filter.

A micro-acoustic bandstop filter comprises a serial inductor (130) coupled between first and second ports (110, 120). A circuit block (140) coupled between the first and second port comprises at least one serial capacitance (141) and at least one shunt capacitance (142), wherein the serial and/or the shunt capacitance is realized by a micro-acoustic resonator (141). A shunt inductor (150) is coupled between the circuit block (140) and a terminal for a reference potential (160).

A diplexer having a low band filter and a high band filter is disclosed. The disclosure provides a diplexer having a low band filter and a high band filter for preventing the circuit damage due to an electrostatic discharge in the diplexer itself, and minimizing the signal loss according to addition of an electrostatic discharge prevention circuit.

An electronic component includes a common port, a signal port, a first inductor, a second inductor, and a stack. The first inductor has a first end and a second end. The second end of the first inductor is connected to one end of the second inductor. A first inductor conductor constituting the first inductor is wound about an axis extending in a first direction. A second inductor conductor constituting the second inductor is wound about an axis extending in a second direction intersecting the first direction.

An electronic component includes a first and second inductor forming sections integrated with a stack, and a connection conductor layer connecting the first and second inductor forming sections inside the stack. In the first inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer. In the second inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer.

An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.

A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.