A thin-film filter may include a monolithic substrate and a patterned conductive layer formed over the monolithic substrate. The patterned conductive layer may include at least one thin-film inductor. The thin-film filter may have a power capacity that is greater than about 25 W. In some embodiments, the thin-film inductor(s) may be connected between the input port and the output port. A heat sink terminal may be exposed along the bottom surface of thin-film filter. In some embodiments, the heat sink terminal may have an exposed heat sink area, and the bottom surface of the thin-film filter has an area that is less than 20 times larger than the exposed heat sink area.

A filter includes an input terminal, an output terminal, a ground terminal, a first capacitor and a second capacitor that are connected in series between the input terminal and the output terminal, a capacitive element that is connected in parallel to the first capacitor and the second capacitor between the input terminal and the output terminal, and has a Q factor that is smaller than a Q factor of the first capacitor and is smaller than a Q factor of the second capacitor, and an inductor that has a first end and a second end, the first end being coupled to a node that is provided between the first capacitor and the second capacitor and that is coupled to the capacitive element through the first capacitor and the second capacitor, the second end being coupled to the ground terminal.

A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.

An LC filter includes a multilayer body, plate electrodes, capacitor electrodes, and inductor vias. The capacitor electrodes each define a capacitor between the plate electrode and a corresponding one of the capacitor electrodes. A first inductor via is connected between a first capacitor electrode and a first plate electrode. A second inductor via is connected between a second capacitor electrode and the first plate electrode. A third inductor via is connected between a third capacitor electrode and the first plate electrode. A fourth capacitor electrode faces the first and second capacitor electrodes. A fifth capacitor electrode faces the second and third capacitor electrodes. A sixth capacitor electrode faces the first and third capacitor electrodes.

A band pass filter includes filter circuits, first and second intermediate circuits, and a first capacitor. The first intermediate circuit includes an inductor connected between second and third capacitors. The second intermediate circuit includes an inductor connected between third and fourth capacitors. Resonant circuits included in the filter circuit are connected to ground via a common capacitor. Resonant circuits included in the filter circuit are connected to the ground via a common capacitor. The first capacitor is connected between the first and second intermediate circuits.

A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

Certain aspects of the present disclosure provide a filter circuit and techniques for filtering using the filter circuit. The filter circuit generally includes a first filter stage having a first acoustic wave resonator coupled in a series path between a first port of the filter circuit and a second port of the filter circuit, a first inductor-capacitor (LC) tank circuit, a first capacitor coupled between a first terminal of the first acoustic wave resonator and the first LC tank circuit, the first LC tank circuit being coupled between the first capacitor and a reference potential node, and a second capacitor coupled between a second terminal of the first acoustic wave resonator and the first LC tank circuit. In some aspects, the filter circuit includes one or more other filter stages coupled to the first filter stage.

An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in a first direction in the device body in this order. The first and n-th inductors are provided with a spiral shape or a helical shape such that they turn around respective winding axes extending along a second direction which is perpendicular or substantially perpendicular or substantially perpendicular or substantially perpendicular to the first direction. At least one of the second through (n−1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction.

An electronic component includes an upper surface, a lower surface, a side surface, a circuit pattern, and an upper surface shield electrode. The circuit pattern is provided inside the electronic component. The upper surface shield electrode is disposed on the upper surface. In a plan view from a normal direction of the upper surface, a center of gravity of the upper surface shield electrode is spaced from a center of gravity of the upper surface.