An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.

An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.

A reconfigurable circuit includes: a plurality of first lines; one or more second lines; a non-volatile resistive cell coupling one of the first lines with one of the second lines at each cross-point between the first lines and the second lines; and first switch elements including first terminals respectively coupled to the first lines, wherein each of the first switch elements is separately turned on or off in accordance with a control signal applied thereto.

A reconfigurable circuit comprising: crossbar switches; wires, each of which is coupled to one output port of one crossbar switch and input ports of the other crossbar switches; at least one inverter inserted on each wire for driving long-distance signal transfer, wherein one or less first inverter is inserted on the wire between two adjacent crossbar switches; one or two second inverters inserted between a crossbar switch input port and its connected wire.

Provided is a semiconductor device in which influence resulting from a cell function change can be reduced. The semiconductor device includes a function cell designed using a basic cell including a first wiring layer provided over a main surface of a semiconductor substrate and having a predetermined pattern and a second wiring layer provided over the first wiring layer and having a predetermined pattern. The function cell corresponds to the basic cell which is modified to have a predetermined function by changing the pattern of the second wiring layer at a design stage. The function cell has a first layout and a second layout which are disposed in juxtaposition in one direction in a plane parallel with the main surface. The function cell is provided with the predetermined function by coupling together wires belonging to the respective second wiring layers of the first layout and the second layout.

Provided is a programmable logic integrated circuit wherein even if a failure occurs in any resistance-variable element, remedy would be possible and hence the improvement of reliability has been achieved. In a programmable logic integrated circuit comprising resistance-variable elements, when the states of the resistance-variable elements are to be changed according to externally inputted configuration information, a control means uses a reading means to read the states of the respective resistance-variable elements, and then uses a writing means to change only the states of resistance-changing elements that are different from a state indicated by the configuration information.

A reconfigurable circuit comprising: crossbar switches; wires, each of which is coupled to one output port of one crossbar switch and input ports of the other crossbar switches; at least one inverter inserted on each wire for driving long-distance signal transfer, wherein one or less first inverter is inserted on the wire between two adjacent crossbar switches; one or two second inverters inserted between a crossbar switch input port and its connected wire.

A reconfigurable circuit includes: a plurality of first lines; one or more second lines; a non-volatile resistive cell coupling one of the first lines with one of the second lines at each cross-point between the first lines and the second lines; and first switch elements including first terminals respectively coupled to the first lines, wherein each of the first switch elements is separately turned on or off in accordance with a control signal applied thereto.

Implementations disclosed describe a programmable analog subsystem (PASS) having a plurality of reconfigurable analog circuits. The PASS may be coupled to an input/output device to receive an input signal and to an interface to communicate data with a central processing unit. In a first PASS configuration, with the plurality of reconfigurable analog circuits having a first configuration setting, the PASS may process the input signal through the plurality of reconfigurable analog circuits to generate a first output value based on the input signal. Responsive to the first output value, the PASS may reconfigure the plurality of reconfigurable analog circuits into a second PASS configuration having a second configuration setting, such that the second configuration setting is different than the first configuration setting.

An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.