Patent classifications
H03K19/17764
Defect repair for a reconfigurable data processor for homogeneous subarrays
A device architecture includes a spatially reconfigurable array of processors, such as configurable units of a CGRA, having spare homogenous subarrays, and a parameter store on the device which stores parameters that tag one or more elements as unusable. Configuration data is distributed using a statically reconfigurable bus system, to implement the pattern of placement of configuration data, in dependence on the tagged elements. As a result, a spatially reconfigurable array having unusable elements can be repaired.
SIGNAL GENERATION CIRCUIT, MICRO-CONTROLLER, AND CONTROL METHOD THEREOF
A signal generation circuit including a first control circuit, a second control circuit, an arbiter circuit, and a digital-to-analog converter (DAC) circuit is provided. The first control circuit stores a first string of data. The first control circuit enables a first trigger signal in response to a first event occurring. The second control circuit stores a second string of data. The second control circuit enables a second trigger signal in response to a second event occurring. The arbiter circuit reads the first or second control circuit according to the order of priority to use the first string of data or the second string of data as a digital input in response to the first and second trigger signals being enabled. The DAC circuit converts the digital input to generate an analog output.
SIGNAL GENERATION CIRCUIT, MICRO-CONTROLLER, AND CONTROL METHOD THEREOF
A signal generation circuit including a first control circuit, a second control circuit, an arbiter circuit, and a digital-to-analog converter (DAC) circuit is provided. The first control circuit stores a first string of data. The first control circuit enables a first trigger signal in response to a first event occurring. The second control circuit stores a second string of data. The second control circuit enables a second trigger signal in response to a second event occurring. The arbiter circuit reads the first or second control circuit according to the order of priority to use the first string of data or the second string of data as a digital input in response to the first and second trigger signals being enabled. The DAC circuit converts the digital input to generate an analog output.
REFERENCE BUFFER
A reference voltage generator comprises a comparator, a digital-to-analog converter (DAC) and a switched capacitor accumulator. The comparator receives a reference voltage input, a feedback input, and a control signal. The DAC is coupled to an output of the comparator, and the switched capacitor accumulator is coupled to an output of the DAC. In some implementations, a digital filter is coupled between the output of the comparator and the input of the DAC. The switched capacitor accumulator can be coupled to a buffer that outputs the feedback input and a reference voltage for an analog-to-digital converter (ADC). In some implementations, the feedback loop includes N one-bit DACs coupled to the output of the comparator and N switched capacitor accumulators, each of which is coupled to a unique one-bit DAC.
MULTI-DIE FPGA IMPLEMENTING BUILT-IN ANALOG CIRCUIT USING ACTIVE SILICON CONNECTION LAYER
The present application discloses a multi-die FPGA implementing a built-in analog circuit using an active silicon connection layer, and relates to the field of FPGA technology. The multi-die FPGA allows multiple small-scale and small-area dies to cascade to achieve large-scale and large-area FPGA products, reducing processing difficulties and improving chip production yields. Meanwhile, due to the existence of the active silicon connection layer, some circuit structures that are difficult to implement within the die and/or occupy a large die area and/or have a low processing requirement can be laid out in the silicon connection layer, solving the existing problems of making these circuit structures directly within the die. Part of the circuit structures can be implemented within the silicon connection layer and the rest in the die, which helps optimize the performance of FPGA products, improve system stability, and reduce system area.
MULTI-DIE FPGA IMPLEMENTING BUILT-IN ANALOG CIRCUIT USING ACTIVE SILICON CONNECTION LAYER
The present application discloses a multi-die FPGA implementing a built-in analog circuit using an active silicon connection layer, and relates to the field of FPGA technology. The multi-die FPGA allows multiple small-scale and small-area dies to cascade to achieve large-scale and large-area FPGA products, reducing processing difficulties and improving chip production yields. Meanwhile, due to the existence of the active silicon connection layer, some circuit structures that are difficult to implement within the die and/or occupy a large die area and/or have a low processing requirement can be laid out in the silicon connection layer, solving the existing problems of making these circuit structures directly within the die. Part of the circuit structures can be implemented within the silicon connection layer and the rest in the die, which helps optimize the performance of FPGA products, improve system stability, and reduce system area.
Field programmable gate array (FPGA) with automatic error detection and correction function for programmable logic modules
A field programmable gate array (FPGA) with an automatic error detection and correction function for programmable logic modules includes an error checking and correction device. A check code generation circuit in the error checking and correction device performs error correcting code (ECC) encoding according to input data of corresponding programmable logic registers to generate a check code, and refreshes and writes the check code into a check code register according to a clock signal. A check circuit checks outputs of the programmable logic registers and check code registers to generate syndromes for implementing checking. A decoding circuit generates upset signals corresponding to the syndromes according to a trigger enable pulse of a trigger circuit to control a fault register to directly and asynchronously upset content to correct the error. A circuit area is greatly reduced by using the FPGA, thereby improving a degree of integration of the circuit.
Reference buffer
A reference voltage generator comprises a comparator, a digital-to-analog converter (DAC) and a switched capacitor accumulator. The comparator receives a reference voltage input, a feedback input, and a control signal. The DAC is coupled to an output of the comparator, and the switched capacitor accumulator is coupled to an output of the DAC. In some implementations, a digital filter is coupled between the output of the comparator and the input of the DAC. The switched capacitor accumulator can be coupled to a buffer that outputs the feedback input and a reference voltage for an analog-to-digital converter (ADC). In some implementations, the feedback loop includes N one-bit DACs coupled to the output of the comparator and N switched capacitor accumulators, each of which is coupled to a unique one-bit DAC.
HYBRID SYNCHRONOUS AND ASYNCHRONOUS CONTROL FOR SCAN-BASED TESTING
An integrated circuit includes an intellectual property core, scan data pipeline circuitry configured to convey scan data to the intellectual property core, and scan control pipeline circuitry configured to convey one or more scan control signals to the intellectual property core. The integrated circuit also includes a wave shaping circuit configured to detect a trigger event on the one or more scan control signals and, in response to detecting the trigger event, suppress a scan clock to the intellectual property core for a selected number of clock cycles.
POWER CONTROL WITHIN A DATAFLOW PROCESSOR
Techniques are disclosed for power conservation. A plurality of processing elements and a plurality of instructions are configured. The plurality of processing elements is controlled by instructions contained in a plurality of circular buffers. The plurality of processing elements can comprise a dataflow processor. A first processing element, from the plurality of interconnected processing elements, is set into a sleep state by a first instruction from the plurality of instructions. The first processing element is woken from the sleep state as a result of valid data being presented to the first processing element. A subsection of the plurality of interconnected processing elements is also set into a sleep state based on the first processing element being set into a sleep state. At least one circular buffer from the plurality of circular buffers remains awake while the first processing element is in the sleep state, and the at least one circular buffer provides for data steering through a reconfigurable fabric.