A clock integrated circuit is provided. The clock integrated circuit includes: a first clock generator which includes a crystal oscillator configured to generate a first clock signal; and a second clock generator which includes a resistance-capacitance (RC) oscillator and a first frequency divider, and is configured to: generate a second clock signal using the first frequency divider based on a clock signal output from the RC oscillator; perform a first calibration operation for adjusting a frequency division ratio of the first frequency divider to a first frequency division ratio based on the first clock signal; and perform a second calibration operation for adjusting the first frequency division ratio to a second frequency division ratio based on a sensed temperature.

A circuit device includes an oscillation circuit generating an oscillation signal by oscillating a vibrator, a temperature sensor circuit performing an intermittent operation, a logic circuit performing temperature compensation processing based on an output of the temperature sensor circuit, and a power supply circuit supplying power to the oscillation circuit. Further, the logic circuit or the power supply circuit is disposed between the oscillation circuit and the temperature sensor circuit.

A clock source includes a comparator having a positive comparator input, a negative comparator input, a proportional to absolute temperature (PTAT) PMOS bias input, a PTAT NMOS bias input, and a comparator output, a resonator element, series and feedback resistors and other passive components coupled between the comparator output and the negative comparator input to generate a signal with approximately constant gain and frequency at the comparator output, and a PTAT bias circuit coupled to the comparator's PTAT PMOS and NMOS bias inputs, and configured to drive the PTAT PMOS bias input and the PTAT NMOS bias input to maintain approximately constant gain and frequency over the operating temperature range of the clock source.

A circuit with a plurality of analog circuit blocks, each configured to provide at least one analog function and a programmable interconnect coupled of the analog circuit blocks and configurable to interconnect combinations of the analog circuit blocks to one another. The circuit is formed in an integrated circuit (chip) and the programmable interconnect comprises a plurality of switches coupled between the analog circuit blocks and ports that provide signal connections for the chip.

Various implementations described herein refer to an integrated circuit having a first stage and a second stage. The first stage has a step-down converter coupled to an oscillator between a first voltage supply and a second voltage supply. The second stage is coupled to the first stage, and the second stage has a current bias generator coupled to a diode-connected transistor between the first voltage supply and the second voltage supply. The second stage provides an intermediate voltage to the first stage.

A clock integrated circuit is provided. The clock integrated circuit includes: a first clock generator which includes a crystal oscillator configured to generate a first clock signal; and a second clock generator which includes a resistance-capacitance (RC) oscillator and a first frequency divider, and is configured to: generate a second clock signal using the first frequency divider based on a clock signal output from the RC oscillator; perform a first calibration operation for adjusting a frequency division ratio of the first frequency divider to a first frequency division ratio based on the first clock signal; and perform a second calibration operation for adjusting the first frequency division ratio to a second frequency division ratio based on a sensed temperature.

A circuit device includes an oscillation circuit generating an oscillation signal by oscillating a vibrator, a temperature sensor circuit performing an intermittent operation, a logic circuit performing temperature compensation processing based on an output of the temperature sensor circuit, and a power supply circuit supplying power to the oscillation circuit. Further, the logic circuit or the power supply circuit is disposed between the oscillation circuit and the temperature sensor circuit.

Various implementations described herein refer to an integrated circuit having a first stage and a second stage. The first stage has a step-down converter coupled to an oscillator between a first voltage supply and a second voltage supply. The second stage is coupled to the first stage, and the second stage has a current bias generator coupled to a diode-connected transistor between the first voltage supply and the second voltage supply. The second stage provides an intermediate voltage to the first stage.

Various implementations described herein refer to an integrated circuit having a first stage and a second stage. The first stage has a step-down converter coupled to an oscillator between a first voltage supply and a second voltage supply. The second stage is coupled to the first stage, and the second stage has a current bias generator coupled to a diode-connected transistor between the first voltage supply and the second voltage supply. The second stage provides an intermediate voltage to the first stage.

A device includes a capacitor having a first terminal coupled to a ground node, and a second terminal; a first transistor having a source coupled to the capacitor, a drain coupled to a first node, and a gate; a first current source coupled to the first node and configured to couple to a regulated supply node; a second transistor having a source coupled to the ground node, a drain coupled to a second node, and a gate coupled to the second node and to the gate of the first transistor; and a comparator circuit having an input coupled to the first node and an output configured to couple to a clock node.