A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

A packaged VCTCXO may include a crystal oscillator configured to output a signal of a particular frequency and a temperature sensor configured to measure an internal temperature of the crystal oscillator. In addition, the packaged VCTCXO may include a microcontroller configured to generate an internal control voltage signal based at least in part on the temperature and an external control voltage received by the packaged VCTCXO. Moreover, the packaged VCTCXO may include a combiner configured to combine an internal control voltage and the external control voltage to generate a control voltage. Further, the control voltage may be supplied to the crystal oscillator to cause the crystal oscillator to generate the signal of the particular frequency.

A circuit device includes a first terminal, a first oscillation circuit oscillating a resonator and generating a first voltage for automatic gain control for controlling amplitude of a signal output from the resonator, a digital signal generation circuit generating a digital signal corresponding to the first voltage, and a first interface circuit outputting the digital signal to the first terminal.

The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.

The present disclosure relates to a method for controlling a device comprising an oscillation circuit, configured to provide a clock signal to a radio frequency circuit, and an antenna, in which the enabling of the passage of the signal from the circuit to the antenna is delayed with respect to an instant from which a power amplifier of the circuit is enabled.

The present disclosure relates to an electronic device comprising a first capacitor and a quartz crystal coupled in series between a first node and a second node; an inverter coupled between the first and second nodes; a first variable capacitor coupled between the first node and a third node; and a second variable capacitor coupled between the second node and the third node.

A phase locked loop has an oscillator that varies a frequency according to a control signal, a resonance element that resonates at a predetermined resonance frequency and output a signal obtained by shifting a phase of an output signal of the oscillator by 90 degrees at the resonance frequency, a phase detector that detects a phase error between an output signal of the resonance element and an output signal of the oscillator, a feedback controller that controls a frequency of an output signal of the oscillator by proportional control and integral control according to the phase error, and a control signal corrector that corrects the control signal by adding a correction term corresponding to environment information to an output signal of the feedback controller.

A clock source includes a comparator having a positive comparator input, a negative comparator input, a proportional to absolute temperature (PTAT) PMOS bias input, a PTAT NMOS bias input, and a comparator output, a resonator element, series and feedback resistors and other passive components coupled between the comparator output and the negative comparator input to generate a signal with approximately constant gain and frequency at the comparator output, and a PTAT bias circuit coupled to the comparator's PTAT PMOS and NMOS bias inputs, and configured to drive the PTAT PMOS bias input and the PTAT NMOS bias input to maintain approximately constant gain and frequency over the operating temperature range of the clock source.