A packaged VCTCXO may include a crystal oscillator configured to output a signal of a particular frequency and a temperature sensor configured to measure an internal temperature of the crystal oscillator. In addition, the packaged VCTCXO may include a microcontroller configured to generate an internal control voltage signal based at least in part on the temperature and an external control voltage received by the packaged VCTCXO. Moreover, the packaged VCTCXO may include a combiner configured to combine an internal control voltage and the external control voltage to generate a control voltage. Further, the control voltage may be supplied to the crystal oscillator to cause the crystal oscillator to generate the signal of the particular frequency.

Disclosed is a temperature-compensated crystal oscillator based on analog circuit; a closed-loop compensation architecture determines the temperature compensation of a crystal oscillator. The power splitter divides the VCXO's current output signal with frequency f=f.sub.0+Δf into two signals, one signal to output of the TCXO and the other signal is sent to an analog frequency-voltage conversion circuit. According to the frequency of the VCXO's current output signal, the analog frequency-voltage conversion circuit produces a voltage signal V(T), which corresponds to current ambient temperature. The difference between V(T) and a reference voltage signal V.sub.ref is produced and amplified to obtain a compensation voltage signal ΔV through a voltage matching circuit. ΔV is smoothed by a filter, then sent to the voltage control terminal of the VCXO to make the VCXO generate a stable signal with desired frequency f.sub.0, to compensate the frequency of the VCXO's output signal when the ambient temperature is changed.

A circuit device includes a first terminal, a first oscillation circuit oscillating a resonator and generating a first voltage for automatic gain control for controlling amplitude of a signal output from the resonator, a digital signal generation circuit generating a digital signal corresponding to the first voltage, and a first interface circuit outputting the digital signal to the first terminal.

The present disclosure provides a real-time correction method for an Oven Controlled Crystal (Xtal) Oscillator (OCXO) and an electromagnetic receiver. The real-time correction method for an OCXO includes: performing frequency multiplication on a reference clock signal to generate a first measurement signal and a second measurement signal; identifying a rising edge of each pulse per second on the basis of the first measurement signal to obtain a gate time T; obtaining a frequency of the second measurement signal according to the gate time T; and adjusting a frequency of the reference clock signal at least on the basis that an absolute value of a difference between two adjacent frequencies obtained of the second measurement signal is greater than a standard frequency difference.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

An integrated circuit includes a first coupling terminal and a second coupling terminal disposed along a first side, an oscillation circuit which is electrically coupled to a resonator element via the first coupling terminal and the second coupling terminal, a temperature sensor, a temperature compensation circuit configured to compensate a temperature characteristic of the resonator element based on an output signal of the temperature sensor, and an output circuit to which a signal output from the oscillation circuit is input, and which is configured to output an oscillation signal, wherein d1<d0 and d2<d0, in which an end-to-end distance between the temperature sensor and the output circuit is d0, an end-to-end distance between the first coupling terminal and the output circuit is d1, and an end-to-end distance between the second coupling terminal and the output circuit is d2.

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Embodiments of the present disclosure provide a server data sending method and a server data sending apparatus. The method can include: acquiring, by a server, crystal oscillator error information and operating rate information of a terminal; setting, by the server, preamble length information according to the crystal oscillator error information and the operating rate information; and sending, by the server, a downlink data frame to the terminal, the downlink data frame comprising a preamble aligned with the preamble length information.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.