Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.

A radio-frequency switch includes a series field-effect transistor, a shunt field-effect transistor having a gate node, and shunt arm control circuitry configured to receive an internal regulator voltage and provide the internal regulator voltage to the gate node of the shunt field-effect transistor when the radio-frequency switch is in a stand-by mode of operation.

This invention, is concerning a signal voltage device, in which transformers 22a, 22b and a reception circuit 24 are formed on the same chip, and accordingly, no ESD protective element connected to a transformer connection terminal of the reception circuit 24 is required, and negative pulses generated in reception-side inductors 11 can be used in signal transmission. Signal transmission using both positive pulses and negative pulses is made possible as a result, and a stable signal transmission operation can be carried out even in a case where delay time varies in a signal detection circuit. Further, a reception circuit of low power consumption can be configured by using a single-ended Schmitt trigger circuit 14 in the signal detection circuit.

Switch for connecting field apparatuses and device for galvanically isolating at least one apparatus which is connectable to a 2-wire Ethernet bus system includes an uplink and a downlink PHY interface device that each have a transmitting unit and a receiving unit that has two output terminals for providing a received ternary-coded signal as differential signal, includes an uplink and a downlink signal split device that are each connected to the output terminals of an assigned receiving unit and are configured to split a ternary-coded signal provided as differential signal into two binary coded signals, and includes an uplink and a downlink optocoupler device that are each connected to an assigned signal split device and are configured to transfer two received binary-coded signals to a transmitting unit of an assigned PHY interface device.

A digital isolator can include: an encoding circuit configured to receive and encode an input digital signal, in order to generate an encoded signal, wherein a rising edge of the input digital signal is encoded as a first pulse sequence, and a falling edge of the input digital signal is encoded as a second pulse sequence; an isolation element coupled to the encoding circuit, and being configured to transmit the encoded signal in an electrically isolated manner; and a decoding circuit configured to receive the encoded signal through the isolation element, and to decode the encoded signal, in order to generate an output digital signal consistent with the input digital signal.

A semiconductor device has a first area in which first and third semiconductor elements are formed, a second area in which second and fourth semiconductor elements are formed, and a third area located between the first and second areas. On the first to fourth semiconductor elements, a multilayer wiring layer including first and second inductors is formed. A through hole penetrating the semiconductor substrate is formed in the third area, and a first element isolation portion protruding from a front surface side of the semiconductor substrate toward a back surface side of the semiconductor substrate is formed in the through hole. Further, on the back surface side of the semiconductor substrate, the semiconductor substrate in the first area is mounted on the first die pad, and the semiconductor substrate in the second area is mounted on the second die pad.

LED drive control circuitry according to one embodiment outputs an LED drive control signal serving as driving a light emitting diode included in a photocoupler that performs insulation communication in synchronization with a reference clock signal. The LED drive control circuit includes a duty cycle changer that changes a duty cycle of the LED drive control signal in accordance with the reference clock signal and a signal synchronized with the reference clock signal.

In some examples, a device includes a capacitor arranged across the galvanic isolation barrier, where the capacitor is configured to communicate a single-ended signal from a first voltage domain to a second voltage domain. The device also includes a high-pass filter arranged in the second voltage domain and configured to receive the single-ended signal from the capacitor. The device further includes a low-pass filter arranged in the second voltage domain and coupled between the high-pass filter and a low-impedance node. The high-pass filter is coupled between the capacitor, the low-pass filter, and the low-impedance node, and the low-pass filter is configured to generate a differential signal.

Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first IO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.

A controller comprising a driver interface referenced to a first reference potential, a drive circuit referenced to a second reference potential, and an inductive coupling. The driver interface comprises a first receiver configured to compare a portion of signals having a first polarity on the first terminal of the inductive coupling with a first threshold, and a second receiver configured to compare a portion of signals having a second polarity on the second terminal of the inductive coupling with a third threshold. The drive circuit comprises a first transmitter configured to drive current in a first direction in the second winding to transmit first signals, and a second transmitter configured to drive current in a second direction in the second winding to transmit second signals, the second direction opposite the first direction.