A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

A high-speed circuit includes a printed circuit board, a ground plane layer, a pair of first and second differential traces, and a cascading common mode filter. The printed circuit board has a first surface and an opposite second surface. The ground plane layer has a first surface in contact with the second surface of the printed circuit board. The pair of first and second differential traces are on the first surface of the printed circuit board. The first and second differential traces carry an electrical signal. The cascading common mode filter includes an outer and an inner common mode filter. The outer common mode filter includes a U-shaped void section on the first surface of the ground plane layer. The inner common mode filter includes an H-shaped void section on the first surface of the ground plane layer. The H-shaped void section is located proximate to the U-shaped void section.

Even when a grounding capacitor is included at either end of a common mode coil, there is noise that flows from a load into a metal frame, and there is a need to restrict an amount of noise propagating to a system power supply. Because of this, a noise loop is formed of a rectifier circuit, an inverter, a first electrical wire that connects a positive polarity side of the rectifier circuit and the inverter, a second electrical wire that connects a negative polarity side of the rectifier circuit and the inverter, a ground wire terminal that can connect a load connected to an output terminal or the inverter, and a conductive plate that connects at least one or the first electrical wire and second electrical wire and the ground wire terminal.

Provided is a structure including a first conductor plane (101); a second conductor plane (102); a first transmission line (104) that is formed in a layer different from the first conductor plane (101) and the second conductor plane (102); a second transmission line (105) that is disposed so as to face the second conductor plane (102) in a layer opposite to the first transmission line (104) with respect to the second conductor plane (102); a first conductor via (103) that connects one end of the first transmission line (104) with the first conductor plane (101); a second conductor via (106) that connects another end of the first transmission line (104) with one end of the second transmission line (105); and a slit (107) that is formed on the second conductor plane (102).

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

A printed circuit board includes a reference plane embedded in a substrate and adjacent to the top surface of the substrate. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer on the top surface of the substrate covers the substrate, the first signal net and the second signal net, and includes an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region, such that the conductive layer overlaps with the first signal net. A fifth signal net is embedded in the substrate and between the reference plane and the outermost insulating layer.

A circuit board for a display device includes: a signal line to transmit signal, a first metallic layer overlapping the signal line, a first conductive layer spaced apart from the first metallic layer, a base layer insulating the signal line from the first metallic layer and from the first conductive layer, and a first capacitor including a first terminal electrically coupled to the first metallic layer and a second terminal electrically coupled to the first conductive layer.

An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.

A circuit board comprising a circuit board ply, on which are provided a high-frequency component emitting electromagnetic interference waves during operation and at least one other component, especially another high-frequency component, wherein during operation an as low as possible degrading of the other component by interference waves is achieved. There is provided between the high-frequency component and the other component at least one dielectric barrier, which blocks propagation of high-frequency electromagnetic waves between the high-frequency component and the other component.