A filter circuit includes: a wiring pattern provided in an upper wiring layer of a printed circuit board, a wiring pattern provided in a lower wiring layer of the printed circuit board, a wiring pattern extending from one end of the wiring pattern, a wiring pattern provided so as to partially face the wiring pattern in the upper wiring layer, a bypass capacitor provided in the upper wiring layer and connected to the wiring pattern and a ground conductor surface, a via connecting one end of the wiring pattern and the wiring pattern, and a via connecting the wiring pattern and the wiring pattern. A structure including the wiring pattern, the via, and the wiring pattern faces a structure including the via and the wiring pattern.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

A semiconductor device includes: a thick copper member in which a semiconductor chip is mounted; a printed circuit board that is disposed on a front surface of the thick copper member and provided with an opening exposing a part of the front surface of the thick copper member, a wiring pattern, and conductive vias connecting the pattern and the thick copper member; a semiconductor chip mounted on the front surface of the thick copper member exposed through the opening and connected to the pattern by a metal wire; an electronic component mounted on a front surface of the printed circuit board opposite to a side facing the thick copper member and connected to the pattern; and a cap or an epoxy resin sealing the front surface of the printed circuit board opposite to a side facing the thick copper member, the chip, the component, and the metal wire.

The present disclosure relates to a radar apparatus including a circuit board provided inside a housing having an upper side open, and on which an RF element is mounted on an upper surface, and a cavity having an open lower side and coupled to the upper surface of the circuit board for accommodating the RF element, wherein the cavity includes a coupling portion extending downwardly in a region of a surface coupled to the circuit board, and the coupling portion is inserted into a coupling hole formed in the circuit board to contact a ground plane of the circuit board.

An antenna assembly for a transceiver having first antennas arranged on a circuit board, a transmitting and receiving circuit arranged on the circuit board. The first antennas are connected to the transmitting and receiving circuit. Second antennas and terminating resistors are arranged on the circuit board. Each second antenna is connected to one of the terminating resistors by means of a strip line. At least one first contact for measuring HF properties of one of the second antennas and / or at least one second contact for measuring HF properties of the terminating resistor connected to the measurement antenna is arranged on the circuit board. The strip line between the measurement antenna and the terminating resistor is disconnectable at a disconnection point, and the strip line forms, on the side of the disconnection point nearest the measurement antenna, a third contact for measuring the HF properties of the measurement antenna.

A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

A wiring board with a filter circuit includes an insulating base, a conductor pattern, and a filter circuit. The conductor pattern is provided on the insulating base and defines the filter circuit. The insulating base includes an intermediate member, and first through third end members connected to the intermediate member. A first external connection terminal is provided on the first end member, and is disposed on a first end of the conductor pattern in the signal transmission direction. A second external connection terminal is provided on the second end member, and is disposed on a second end of the conductor pattern in the signal transmission direction. A first ground connection terminal that grounds the filter circuit is provided on the intermediate member. A second ground connection terminal that grounds the filter circuit is provided on the third end member.

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.