The present disclosure relates to an electronic device (10) comprising at least one electrically conductive structure (11) with a tubular shape having outer and inner surfaces (11c, 11d) covered by an insulating layer (12), and one or more integrated circuits (13) positioned within the electrically conductive structure (11).

A surface mountable coupler may include a monolithic base substrate having a first surface, a second surface, a length in an X-direction, and a width in a Y-direction that is perpendicular to the X-direction. A plurality of ports may be formed over the first surface of the monolithic base substrate including a coupling port, an input port, and an output port. The coupler may include a first thin film inductor and a second thin film inductor that is inductively coupled with the first thin film inductor and electrically connected between the input and output ports. A thin film circuit may electrically connect the first thin film inductor with the coupling port. The thin film circuit may include at least one thin film component.

A radio-frequency module includes a mounting substrate, a first filter, a second filter, a shield layer, and a conductor. The mounting substrate has a first main surface and a second main surface on opposite sides. The shield layer is disposed on an outer surface of a resin layer with which the first filter and the second filter are covered. The radio-frequency module is capable of performing simultaneous transmission by using both the first filter and the second filter. The conductor is disposed on the first main surface of the mounting substrate and is in contact with the transmitting filter and the mounting substrate. The conductor is in contact with the shield layer on a side other than a side closer to the second filter than to the first filter.

A module substrate antenna (1) includes a first coil (7) and a second coil (8) that are connected in parallel. The first coil (7) is composed of a pattern in which a spiral first antenna coil pattern (3a) and a spiral second antenna coil pattern (5a) are interlayer-connected in series. The second coil (8) is composed of a pattern in which a spiral third antenna coil pattern (4a) and a spiral fourth antenna coil pattern (6a) are interlayer-connected in series. The coil patterns are arranged in order of the first antenna coil pattern (3a), the third antenna coil pattern (4a), the second antenna coil pattern (5a), and the fourth antenna coil pattern (6a).

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

An amplifier device includes a substrate, a composite packaged amplifier having a bottom plate and an output plate, a first amplifier and a second amplifier provided on the bottom plate, a combining node that combines an output of the first amplifier with an output of the second amplifier, an output matching circuits provided on the bottom plate, that has a first transmission line provided between the first amplifier and the combining node, and a second transmission line provided between the combining node and the second amplifier, a third transmission line having one transmission line on which the output plate is mounted and other transmission line that connects the one transmission line to the external port, and wirings connecting to one terminal of the output plate and the combining node. A length of the output plate and the other transmission line is equal or less than π/4 radian for a signal.

The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

Length matching and phase matching between circuit paths of differing lengths is disclosed. Two signals are specified to arrive at respective path destinations at a predetermined time and with a predetermined phase. An IC provides a first electronic signal over a first conductive path to a first destination and a second electronic signal over a second conductive path to a second destination. A first slow wave structure comprises the first conductive path and a second slow wave structure comprises the second conductive path. The effective relative permittivity of the first slow wave structure is tuned such that the first electronic signal arrives at its destination at a first time and at a first phase, and the effective relative permittivity of the second slow wave structure is tuned such that the second electronic signal arrives at its destination at a second time and at a second phase.

Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.