An ESD protection circuit includes a trigger transistor that is responsive to a detection signal indicating an ESD event. The trigger transistor pulls the voltage of a hold node towards a voltage of a power supply rail in response to the detection signal indicating an ESD event. The ESD protection circuit includes a replica trigger transistor whose leakage current controls current provided to the hold node after the detection signal no longer indicates an ESD event to compensate for leakage current through the trigger transistor.

An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.

A phase shifter includes a signal input, a signal output, an ESD protection circuit, first and second signal paths between the signal input and the signal output. The ESD protection circuit includes first and second two port devices, each two port device being switchable between a high impedance state and a low impedance state. The first signal path includes the first two port device of the ESD protection circuit and a first delay line configured to provide a first phase shift to a signal transmitted from the signal input to the signal output via the first signal path. The second signal path includes the second two port device of the ESD protection circuit and a second delay line configured to provide a second phase shift, different from the first phase shift, to the signal transmitted from the signal input to the signal output via the second signal path.

Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Such a ball grid array may include a plurality of solder balls that are electrically coupled by a non-linear conductive routing. The non-linear conductive routing may include a plurality of routing sections where each of the plurality of routing sections is disposed at an angle to adjacent routing sections.

The present disclosure provides an electronic device including a substrate, an extending element, a conductive element and a first insulating layer. The substrate includes an edge. The extending element is disposed on the substrate and includes a first conductive layer and a semiconductor layer, the first conductive layer and the semiconductor layer are overlapped, and the semiconductor layer extends to the edge of the substrate. The conductive element is overlapped with the first conductive layer. The insulating layer is disposed between the conductive element and the extending element.

The present disclosure provides an electronic device including a substrate, a conductive pad, a chip and an insulating layer. The conductive pad is disposed on the substrate. The chip is disposed on the conductive pad. The insulating layer is disposed between the conductive pad and the chip, wherein the insulating layer includes an opening, and the chip is electrically connected to the conductive pad through the opening. An outline of the opening includes a plurality of curved corners in a normal direction of the substrate.

Provided is a display apparatus including a liquid crystal panel, a substrate, a light source module disposed on the substrate, and a control assembly configured to control the light source module and the liquid crystal panel. The light source module includes a light emitting diode disposed on the substrate, a feed pad provided on the substrate, and at least one antistatic pad provided on the substrate.

Aspects of this disclosure relate to detecting and recording information associated with electrical overstress (EOS) events, such as electrostatic discharge (ESD) events. For example, in one embodiment, an apparatus includes an electrical overstress protection device, a detection circuit configured to detect an occurrence of the EOS event, and a memory configured to store information indicative of the EOS event.

A circuit assembly includes a sealable enclosure and at least one electronic circuit element contained within the sealable enclosure. The at least one electronic circuit element includes a control circuit, a garnet, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet. A second polymer material fills a remaining space defined within the enclosure, the second polymer material applied on an exposed surface of the first material.

A display device is provided and includes touch panel including first substrate, detection electrodes located in a detection area on first substrate, and outer peripheral lines provided in peripheral area on first substrate and electrically connected to detection electrodes; display panel overlapping touch panel in plan view; insulating layer covering detection electrodes and having surface facing display panel; protection film overlapping outer peripheral lines and provided on surface of insulating layer; polarizer disposed between insulating layer and display panel; and insulating material contacting surface of insulating layer between protection film and polarizer, side surface of protection film and side surface of polarizer, and not directly contacting detection electrodes.