A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.

A data storage device includes a memory module including a circuit board, a plurality of light emitting elements and a light guiding unit. The light emitting elements are electrically connected to the circuit board. The light guiding unit includes a light-homogenizing plate and a light output portion. The plate is disposed between the light output portion and the light emitting elements. A light diffusion space is disposed between the plate and the light output portion. The light emitted by the light emitting elements propagates sequentially into the plate, the light diffusion space, and the light output portion and then is output through the light output portion.

A sensor is provided and includes a first control line; a first signal line; a first auxiliary line; a first detection electrode; a first detection switch connected to the first detection electrode, the first control line and the first signal line; and a first shielding electrode connected to the first auxiliary line, wherein the first shielding electrode is located to overlap the first signal line via an insulating film.

A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.

A component carrier including (a) a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; (b) an optical component embedded within the stack, wherein the optical component comprises an optically active portion; (c) an opening formed within the stack, wherein the optical component and the opening are spatially arranged and configured such that an optical communication between the optically active portion and an exterior of the stack is enabled; and (d) a protection structure extending at least partially around the optically active portion and/or the opening. The protection structure protects the optically active portion from a resin flow during an embedding of the optical component in the stack. A method for manufacturing such a component carrier.

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The stack has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section. The cavity stack section at least partially surrounds the central stack section, and the thickness of the central stack section is greater than the thickness of the cavity stack section.

Disclosed herein are embodiments of a wound treatment apparatus with electronic components integrated within a wound dressing. In some embodiments, a wound dressing apparatus can comprise a wound dressing. The wound dressing can comprise an absorbent material, an electronics unit comprising a negative pressure source, the electronics unit integrated within the wound dressing and at least partially encapsulated by a flexible film. The electronics unit can include translucent or transparent components that allow light to travel through to reach adhesives or coatings on the electronic components that would otherwise be obscured.

An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.