A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.

A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

The invention described herein provides a dry graphene powder composition comprising pristine graphene flakes, wherein the pristine graphene flakes are non-covalently functionalised with polymeric amphiphilic molecules and wherein the dry graphene powder composition is capable of forming a stable homogeneous dispersion in aqueous or alcoholic media, in the absence of free dispersants or stabilizers, as well as methods for producing same, and the use thereof in graphene inks, for 2D and 3D printing, for production of flexible circuits, electrodes, electrocatalysts, for fabrication of nanocomposites and for wet-spinning of pristine graphene fibers.

Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

The present disclosure relates to a motor for an extracorporeal blood pump, an extracorporeal blood pump, and an extracorporeal blood pump system. The motor for an extracorporeal blood pump comprises: a housing; an actuator located in the housing and used for driving an impeller in a pump head of the extracorporeal blood pump; at least one sensor located in the housing; and a motor driving-control assembly located in the housing and used to control operation of the motor. Integrating the motor driving-control assembly into the housing of the motor can significantly reduce the dependence of the motor on the control host of the extracorporeal blood pump, the risk of communication failure between the motor and the control host, and the risk of malfunction of the motor driving-control assembly, thereby greatly improving the safety and reliability of the extracorporeal blood pump.

Provided is an antenna structure configured to wirelessly charge, the antenna structure including an insulating substrate, a coil formed on a first surface of the insulating substrate in a winding structure, the coil being wound a certain number of times in a clockwise and/or a counterclockwise direction around an axis normal to the insulating substrate, a coating layer including a first magnetic material, the coating layer being disposed adjacent to and surrounding the coil in a winding structure corresponding to the winding structure of the coil, and a shielding sheet including a second magnetic material and facing the second surface of the insulating substrate.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.